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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 2011-2020 of 2029
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ninety percent of high temperature electronic devices operate in temperatures in the range of 150 to 300 °C, and for such temperature needs, technologies typical for the military range might be adapted. To make it possible, ...
Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn ...
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in ...
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two-phase immersion cooling (2PIC) has been proposed as a means of economically increasing overall energy efficiency while accommodating increased chip powers and system-level power density. Designers unfamiliar with ...
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies ...
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A finite element simulation analysis model was developed for a plastic ball grid array (PBGA) assembly to analyze its behavior under thermal cyclic loading conditions. The stress distribution in the SAC305 solder joints ...
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger ...
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407.
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present our results on a relatively new kind of blower called Volumetric Resistance Blower (VRB) for cooling of portable computing platforms like laptop computers. The VRB performance was modeled numerically ...
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, ...