Process Development for Printed Copper With Surface Mount Devices on Inkjet MetallizationSource: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002::page 21011-1DOI: 10.1115/1.4055986Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Despite its status, it is not without its challenges. Inkjet technology has gained much attention due to its low cost, low-material consumption, and capability for mass manufacturing. The preferred conductive metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given toward photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the electrical and mechanical properties of copper. With the process developed, the resistivity of printed copper was found to be five times the bulk copper. In regards to adhesion to the polyimide film, mechanical shear load to failure was found to be within 15–20 gF. To demonstrate the complete process, commercial-off-the-shelf components are also mounted on the additively printed pads. Statistically, control charting technique is implemented to understand any process variation over long duration of prints.
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contributor author | Lall, Pradeep | |
contributor author | Goyal, Kartik | |
contributor author | Hill, Curtis | |
date accessioned | 2023-11-29T18:33:16Z | |
date available | 2023-11-29T18:33:16Z | |
date copyright | 11/23/2022 12:00:00 AM | |
date issued | 11/23/2022 12:00:00 AM | |
date issued | 2022-11-23 | |
identifier issn | 1043-7398 | |
identifier other | ep_145_02_021011.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4294218 | |
description abstract | Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Despite its status, it is not without its challenges. Inkjet technology has gained much attention due to its low cost, low-material consumption, and capability for mass manufacturing. The preferred conductive metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given toward photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the electrical and mechanical properties of copper. With the process developed, the resistivity of printed copper was found to be five times the bulk copper. In regards to adhesion to the polyimide film, mechanical shear load to failure was found to be within 15–20 gF. To demonstrate the complete process, commercial-off-the-shelf components are also mounted on the additively printed pads. Statistically, control charting technique is implemented to understand any process variation over long duration of prints. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization | |
type | Journal Paper | |
journal volume | 145 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4055986 | |
journal fristpage | 21011-1 | |
journal lastpage | 21011-10 | |
page | 10 | |
tree | Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002 | |
contenttype | Fulltext |