Journal of Electronic Packaging
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EISSN:1944-7078|ISSN:1530-9827|Disc:The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications|Priority:4|Publisher:American Society of Mechanical Engineers|
Recent Submissions
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Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
(The American Society of Mechanical Engineers (ASME), 2025)- -
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
(The American Society of Mechanical Engineers (ASME), 2025)The microstructure transformation, mechanical properties, and fracture behavior of boron (B) decorated tin (Sn)-1.5%Ag-0.7%copper (Cu) (SAC157) solder joints with Cu pillars were analyzed. Three concentrations of B (0.015%, ... -
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
(The American Society of Mechanical Engineers (ASME), 2025)Loop thermosiphons (LTSs) are highly effective two-phase heat spreaders, enabling significant heat transport through passive liquid–vapor phase-change, particularly beneficial in electronics cooling. However, prior studies ... -
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
(The American Society of Mechanical Engineers (ASME), 2025)Underfill encapsulation is crucial in assembling flip-chip products, such as ball grid array packages, enhancing the reliability and performance of electronic packages by filling voids between integrated circuit chips and ... -
Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
(The American Society of Mechanical Engineers (ASME), 2025)Automating quality control has been an ongoing effort, especially when manufacturing large flip-chips. One such method is through employing the convolutional neural network (CNN). This work studied the optimum setup of the ... -
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
(The American Society of Mechanical Engineers (ASME), 2025)Heterogeneous integration of electronics is critical to the next wave of electronics applications ranging from extremely power dense energy conversion systems to advanced chiplet and copackaged optics architectures for ... -
Transient Liquid Phase Bond Acceleration Using Copper Nanowires
(The American Society of Mechanical Engineers (ASME), 2024)Increasing heat flux in power electronics modules is taxing the limits of thermal management technologies. This is the result of wide bandgap semiconductor devices with superior voltage blocking capabilities. These same ... -
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
(The American Society of Mechanical Engineers (ASME), 2025)Flexible hybrid electronics featuring wearable electronics offer numerous advantages such as function integration, light-weighting, and flexibility. However, the dynamic flexing of the flexible power sources during usage, ... -
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
(The American Society of Mechanical Engineers (ASME), 2024)Finite element simulations are broadly utilized to calculate the thermally induced mechanical deformations of interconnecting solder materials in electronics. The Anand unified viscoplasticity model is a prevalent choice ... -
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2024)The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional ... -
Optimization of Micropillars Electroplating Bonding Processes and Additives
(The American Society of Mechanical Engineers (ASME), 2025)With the increasing interconnect density of electronic components, copper–copper direct bonding technology has garnered increasing attention from researchers. The electroplating bonding method is an efficient copper pillar ... -
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
(The American Society of Mechanical Engineers (ASME), 2024)Reliability risk in solder joints has been commonly linked to various failure mechanisms, with electromigration (EM) and fatigue among the prominent drivers. Even though these failure mechanisms often occur simultaneously, ... -
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
(The American Society of Mechanical Engineers (ASME), 2024)This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder ... -
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
(The American Society of Mechanical Engineers (ASME), 2024)Traditionally, data centers (DC) have used air cooling for IT equipment, but as graphics processing units (GPUs) evolve, they demand more power and sophisticated cooling. Aiming for efficiency, direct liquid cooling (DLC) ... -
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
(The American Society of Mechanical Engineers (ASME), 2024)In this study, high-temperature hygroscopic swelling characterization of different epoxy mold compounds (EMCs) and dielectric build-up films (DBFs) were analyzed using an experimental technique. The approach maintains ... -
Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
(The American Society of Mechanical Engineers (ASME), 2024)This paper focuses on the response of printed hybrid electronic (PHE) assemblies with polymeric substrates and additively manufactured sintered silver electrical traces subject to extreme mechanical shocks (up to 100,000 g) ... -
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
(The American Society of Mechanical Engineers (ASME), 2024)Sintered silver is a popular material for printing conductive traces in printed hybrid electronics (PHE). However, due to the novel materials and printing techniques in PHEs, reliability still needs to be adequately ... -
Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
(The American Society of Mechanical Engineers (ASME), 2024)Power modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff, in which an aluminum wire delaminates ... -
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
(The American Society of Mechanical Engineers (ASME), 2024)Accelerated testing has been executed to examine the combined influence of electromigration (EM) stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder ... -
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
(The American Society of Mechanical Engineers (ASME), 2024)There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model ...