Journal of Electronic Packaging
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EISSN:1944-7078|ISSN:1530-9827|Disc:The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications|Priority:4|Publisher:American Society of Mechanical Engineers|
Recent Submissions
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Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
(The American Society of Mechanical Engineers (ASME), 5/15/2023 )Two-phase immersion cooling (2PIC) has been proposed as a means of economically increasing overall energy efficiency while accommodating increased chip powers and system-level power density. Designers unfamiliar with ... -
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
(The American Society of Mechanical Engineers (ASME), 12/9/2022 )Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field ... -
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
(The American Society of Mechanical Engineers (ASME), 3/7/2023 1)The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies ... -
Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging
(The American Society of Mechanical Engineers (ASME), 12/9/2022 )The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn ... -
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
(The American Society of Mechanical Engineers (ASME), 11/23/2022)Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in ... -
Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
(The American Society of Mechanical Engineers (ASME), 1/11/2023 )Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production ... -
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
(The American Society of Mechanical Engineers (ASME), 2023)Fiber optic gyroscopes (FOGs) are widely used in attitude control systems of spacecraft such as satellites and Mars rovers for their superior spatial adaptability. However, changes in ambient temperature can cause errors ... -
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
(The American Society of Mechanical Engineers (ASME), 2023)The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave antenna-in-package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using ... -
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
(The American Society of Mechanical Engineers (ASME), 2023)Power electronics is concerned with the use of electronic devices to control and transfer electric power from one form to another. Power electronics can be found in laptop chargers, electric grids, and solar inverters. ... -
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
(The American Society of Mechanical Engineers (ASME), 2023)Liquid metal-based gallium conductors exhibit unique physical and electromechanical properties, which make them excellent candidates for the next generation of wearable electronics. In this study, a novel fluid phase-based ... -
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
(The American Society of Mechanical Engineers (ASME), 2023)One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of ... -
Mandrel Bend Test of Screen-Printed Silver Conductors
(The American Society of Mechanical Engineers (ASME), 2023)Flexible electronics are electronic devices and components that can be stretched, bent, twisted, and folded without losing their functionality. Flexible electronics is conformable, lightweight, easily tailorable, and ... -
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
(The American Society of Mechanical Engineers (ASME), 2022)Power converters and semiconductor devices are spreading their application fields, due to new renewable energy and automotive frameworks. In the electrified vehicles context, the even more stringent requirements, both in ... -
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2022)Single unit cell thick lattice frame materials have applications in efficient heat exchangers. This study is focused on strut-based sandwich-type configurations obtained through reticulation of unit cell topologies of ... -
Effective Constitutive Relations for Sintered Nano Copper Joints
(The American Society of Mechanical Engineers (ASME), 2022)Sintered copper nanoparticles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, the interpretation of accelerated fatigue test results does however ... -
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
(The American Society of Mechanical Engineers (ASME), 2022)Heat spreading from local, time-dependent heat sources in electronic packages results in the propagation of temperature nonuniformities through the stack of material layers attached to the chip. Available models either ... -
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
(The American Society of Mechanical Engineers (ASME), 2022)Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ... -
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
(The American Society of Mechanical Engineers (ASME), 2022)The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low-temperature solder (LTS) alloys have recently ... -
Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
(The American Society of Mechanical Engineers (ASME), 2022)The electromigration (EM) damage is becoming a severe problem in the printed flexible electronics as the printed circuits are fabricated thinner and thinner due to the development of printing technology. In this work, the ... -
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
(The American Society of Mechanical Engineers (ASME), 2022)Miniaturization as well as manufacturing processes that electronics devices are subjected to often results in to increase in operational parameters such as current density, temperature, mechanical load, and with potential ...