Journal of Electronic Packaging
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EISSN:1944-7078|ISSN:1530-9827|Disc:The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications|Priority:4|Publisher:American Society of Mechanical Engineers|
Recent Submissions
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Transient Liquid Phase Bond Acceleration Using Copper Nanowires
(The American Society of Mechanical Engineers (ASME), 2024)Increasing heat flux in power electronics modules is taxing the limits of thermal management technologies. This is the result of wide bandgap semiconductor devices with superior voltage blocking capabilities. These same ... -
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
(The American Society of Mechanical Engineers (ASME), 2025)Flexible hybrid electronics featuring wearable electronics offer numerous advantages such as function integration, light-weighting, and flexibility. However, the dynamic flexing of the flexible power sources during usage, ... -
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
(The American Society of Mechanical Engineers (ASME), 2024)Finite element simulations are broadly utilized to calculate the thermally induced mechanical deformations of interconnecting solder materials in electronics. The Anand unified viscoplasticity model is a prevalent choice ... -
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2024)The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional ... -
Optimization of Micropillars Electroplating Bonding Processes and Additives
(The American Society of Mechanical Engineers (ASME), 2025)With the increasing interconnect density of electronic components, copper–copper direct bonding technology has garnered increasing attention from researchers. The electroplating bonding method is an efficient copper pillar ... -
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
(The American Society of Mechanical Engineers (ASME), 2024)Reliability risk in solder joints has been commonly linked to various failure mechanisms, with electromigration (EM) and fatigue among the prominent drivers. Even though these failure mechanisms often occur simultaneously, ... -
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
(The American Society of Mechanical Engineers (ASME), 2024)This study investigated the thermal fatigue reliability of ball grid array (BGA) solder joints under accelerated thermal cycling, considering the impacts of solder alloy and temperature profile. Applying the Darveaux solder ... -
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
(The American Society of Mechanical Engineers (ASME), 2024)Traditionally, data centers (DC) have used air cooling for IT equipment, but as graphics processing units (GPUs) evolve, they demand more power and sophisticated cooling. Aiming for efficiency, direct liquid cooling (DLC) ... -
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
(The American Society of Mechanical Engineers (ASME), 2024)In this study, high-temperature hygroscopic swelling characterization of different epoxy mold compounds (EMCs) and dielectric build-up films (DBFs) were analyzed using an experimental technique. The approach maintains ... -
Behavior of Polymeric Substrates and Sintered Silver Printed Hybrid Electronic Assemblies Subject to Extreme Acceleration Levels and Elevated Temperatures
(The American Society of Mechanical Engineers (ASME), 2024)This paper focuses on the response of printed hybrid electronic (PHE) assemblies with polymeric substrates and additively manufactured sintered silver electrical traces subject to extreme mechanical shocks (up to 100,000 g) ... -
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
(The American Society of Mechanical Engineers (ASME), 2024)Sintered silver is a popular material for printing conductive traces in printed hybrid electronics (PHE). However, due to the novel materials and printing techniques in PHEs, reliability still needs to be adequately ... -
Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
(The American Society of Mechanical Engineers (ASME), 2024)Power modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff, in which an aluminum wire delaminates ... -
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
(The American Society of Mechanical Engineers (ASME), 2024)Accelerated testing has been executed to examine the combined influence of electromigration (EM) stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder ... -
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
(The American Society of Mechanical Engineers (ASME), 2024)There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model ... -
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
(The American Society of Mechanical Engineers (ASME), 2024)Passive cooling through phase change materials (PCM) creates beneficial complimentary cooling techniques aimed at providing thermal gradient mitigation during device operation without additional power requirements. These ... -
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network
(The American Society of Mechanical Engineers (ASME), 2024)Underfilling in flip chip packages is a critical component of reliability. This study utilized I-type, L-type, and U-type dispensing methods to address the issue, namely, voiding that creates empty spaces, which compromises ... -
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
(The American Society of Mechanical Engineers (ASME), 2024)This paper focuses on the validation of a brazed plate heat exchanger (BPHE) model that acts as the condenser of a novel in-rack cooling loop. In the proposed system, the primary fluid enters as a saturated vapor, while ... -
Microbead Encapsulation for Protection of Electronic Components
(The American Society of Mechanical Engineers (ASME), 2025)This study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy provide ... -
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
(The American Society of Mechanical Engineers (ASME), 2024)Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment ... -
A Review of Mechanism and Technology of Hybrid Bonding
(The American Society of Mechanical Engineers (ASME), 2024)With the development of semiconductor technology, traditional flip-chip bonding has been difficult to meet the high-density, high-reliability requirements of advanced packaging technology. As an advanced three-dimensional ...