Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm AlgorithmSource: Journal of Electronic Packaging:;2025:;volume( 147 ):;issue: 003::page 31005-1DOI: 10.1115/1.4068450Publisher: The American Society of Mechanical Engineers (ASME)
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| contributor author | Zhu, Miao | |
| contributor author | Yang, Xuexia | |
| contributor author | Sun, Yanxi | |
| contributor author | Lin, Jinbao | |
| contributor author | Liu, Erqiang | |
| contributor author | Wang, Ze | |
| date accessioned | 2025-08-20T09:21:13Z | |
| date available | 2025-08-20T09:21:13Z | |
| date copyright | 5/16/2025 12:00:00 AM | |
| date issued | 2025 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_147_03_031005.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4308136 | |
| description abstract | - | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm | |
| type | Journal Paper | |
| journal volume | 147 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4068450 | |
| journal fristpage | 31005-1 | |
| journal lastpage | 31005-9 | |
| page | 9 | |
| tree | Journal of Electronic Packaging:;2025:;volume( 147 ):;issue: 003 | |
| contenttype | Fulltext |