Communities in DSpace
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In Memoriam of Dr. Malcolm J. Andrews (1958–2019)
(The American Society of Mechanical Engineers (ASME), 2019) -
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
(The American Society of Mechanical Engineers (ASME), 2019)White light-emitting diodes (WLEDs) composed of blue LED chip, yellow phosphor, and red quantum dots (QDs) are considered as a potential alternative for next-generation artificial light source with their high luminous ... -
Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module
(The American Society of Mechanical Engineers (ASME), 2019)Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a ... -
Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
(The American Society of Mechanical Engineers (ASME), 2019)There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics ... -
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
(The American Society of Mechanical Engineers (ASME), 2019)In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...