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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISHeterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No Flow Underfill
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Noflow underfill process has exhibited a narrow feasible process window due to electrical assembly yield loss or underfill voiding. In general, the assembly yield can be improved using reflow process designed at high ...
Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal grease, as a thermal interface material (TIM), has been extensively applied in electronic packaging areas. Generally, thermal greases consist of highly thermally conductive solid fillers and matrix material that ...
A Compact Modeling Approach to Enhance Collaborative Design of Thermal Fluid Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an approach for reducing detailed numerical models of electronic equipment into compact thermalfluid models. These compact models have been created using network analogies representing mass, momentum ...
Analytical Solutions and a Numerical Approach for Diffusion Induced Stresses in Intermetallic Compound Layers of Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Intermetallic compounds (IMC) play a key role in the mechanical reliability of solder joints. The present work investigates the diffusioninduced stress developed in the Cu pad/IMC/solder sandwich structure during a solidstate ...
Comparison of Ball Pull Strength Among Various Sn Cu Ni Solder Joints With Different Pad Surface Finishes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: SnCuNi is one of the most common ternary intermetallic compounds formed in the Snbased solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial ...
The Strength of High Temperature Ag–In Joints Produced Between Copper by Fluxless Low Temperature Processes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two copper (Cu) substrates were bonded using silver (Ag) and indium (In) and annealed at 200–250 آ°C to convert the joints into the solid solution (Ag) for enhanced strength and ductility. Cu–Cu pair was chosen so ...
Room Level Modeling of Air Flow in a Contained Data Center Aisle
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Cold aisle containment is used in air cooled data centers to minimize direct mixing between cold and hot air. Here, we present room level air flow field investigation for open, partially and fully contained cold aisles. ...
Intermittent Failures in Hardware and Software
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Intermittent failures and no fault found (NFF) phenomena are a concern in electronic systems because of their unpredictable nature and irregular occurrence. They can impose significant costs for companies, damage the ...
A New Accurate Closed Form Analytical Solution for Junction Temperature of High Powered Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The peak junction temperature has a profound effect on the operational lifetime and performance of high powered microwave devices. Although numerical analysis can help to estimate the peak junction temperature, it can be ...
Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Hygroscopic and thermal expansion behavior of advanced polymers is investigated when subjected to combined high temperature and moisture conditions. An enhanced experimental–numerical hybrid procedure is proposed to ...