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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISOptimization of a Hybrid Double Side Jet Impingement Cooling System for High Power Light Emitting Diodes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Optimization of a hybrid doubleside jet impingement cooling system for highpower light emitting diodes (LEDs) was performed using a hybrid multiobjective evolutionary approach and threedimensional numerical analysis for ...
Thermal Resistance Analysis of Sn Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To promote heat dissipation in power electronics, we investigated the thermal conduction performance of SnBi solder paste between two Cu plates. We measured the thermal resistance of SnBi solder paste used as thermal ...
Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper we introduce a hybrid fin heat sink (HFH) proposed for the thermal control of light emitting diode (LED) lighting modules. The HFH consists of the array of hybrid fins which are hollow pin fins having internal ...
Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigates the thermal and fluid dynamic characteristics due to multiple miniature axial fans with blade chord and span length scales less than 10 mm, impinging air onto finned surfaces. A coupled approach, ...
Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the ...
In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with ...
Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve ...
Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Behavior of solder joints in microelectronic packages is crucial to the drop impact reliability design of mobile electronic products. In this paper, tensile behaviors of Sn37Pb, Sn3.5Ag, and ...
Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study analyzed the reliability of two condition types of copper leadframe, namely, good and oxidized. Both types of leadframe were used in the fabricating process of a quad flat no-lead ...
Laser-Based Target Preparation in 3D Integrated Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging ...