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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISEffect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study examines the refrigerant distribution of a dual cold-plate system subject to the influence of heating load, using a R-134a based vapor compression system with a nominal capacity ...
A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By ...
In-Plane Packaging Stress Measurements Through Piezoresistive Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In our previous works, the piezoresistive sensors have been demonstrated to be accurate and efficient tools for stress measurements in microelectronic packaging. In this study, we first designed ...
Two Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent trends including rapid increases in the power ratings and continued miniaturization of semiconductor devices have pushed the heat dissipation of power electronics well beyond the range of conventional thermal ...
Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A variational method involving stress functions is used to determine the interlaminar stresses and the free-edge effects in a laminated beam under a temperature loading. The stress function in ...
An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An improved means of obtaining the elastic constants of component-lead-board assemblages from two three-point bending tests and one four-point torsion test is proposed. The suggested method models ...
Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experimental results for thermal systems consisting of pin-fin heat sinks situated below chimneys are presented. System-level heat transfer and porosity optimization results are compared with ...
Lead-Free Implementation and Production–A Manufacturing Guide
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lead-Free Implementation and Production–A Manufacturing Guide,. McGraw-Hill, New York, NY, 2005, 473 pp., $99.95, ISBN: 0-07-144374-6
Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recently, accelerated testing of surface mount interconnects under combined temperature and vibration environments has been recognized to be a necessary activity to ensure enhanced test-time ...
Moiré Interferometry Analysis of Laser Weld Induced Thermal Strain
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental method is presented to study laser weld induced thermal strain using digital image analysis enhanced moiré interferometry. A phenomenon that occurs in the assembly of optical ...