Optimization of a Hybrid Double Side Jet Impingement Cooling System for High Power Light Emitting DiodesSource: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001::page 11010DOI: 10.1115/1.4026536Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Optimization of a hybrid doubleside jet impingement cooling system for highpower light emitting diodes (LEDs) was performed using a hybrid multiobjective evolutionary approach and threedimensional numerical analysis for steady incompressible laminar flow and conjugate heat transfer using Navier–Stokes equations. For optimization, two design variables, i.e., ratios of the diameter of jet holes and the distance from the exit of upper impinging hole to chips to thickness of substrate were chosen out of the various geometric parameters affecting the performance of the cooling system. To evaluate cooling performance and pressure loss of the system, two objective functions, viz., the ratio of the maximum temperature to average temperature on the chips and pressure coefficient, were selected. Surrogate modeling of the objective functions was performed using response surface approximation. The Paretooptimal solutions were obtained using a multiobjective evolutionary algorithm, and performances of three representative Paretooptimal designs were discussed compared to a reference design. In the optimal designs, higher level of uniform cooling was generally achieved with higher pressure coefficient. The Paretosensitivity analysis between the objective function and design variable was also performed.
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contributor author | Kim, Sun | |
contributor author | Kim, Kwang | |
date accessioned | 2017-05-09T01:06:46Z | |
date available | 2017-05-09T01:06:46Z | |
date issued | 2014 | |
identifier issn | 1528-9044 | |
identifier other | ep_136_01_011010.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/154451 | |
description abstract | Optimization of a hybrid doubleside jet impingement cooling system for highpower light emitting diodes (LEDs) was performed using a hybrid multiobjective evolutionary approach and threedimensional numerical analysis for steady incompressible laminar flow and conjugate heat transfer using Navier–Stokes equations. For optimization, two design variables, i.e., ratios of the diameter of jet holes and the distance from the exit of upper impinging hole to chips to thickness of substrate were chosen out of the various geometric parameters affecting the performance of the cooling system. To evaluate cooling performance and pressure loss of the system, two objective functions, viz., the ratio of the maximum temperature to average temperature on the chips and pressure coefficient, were selected. Surrogate modeling of the objective functions was performed using response surface approximation. The Paretooptimal solutions were obtained using a multiobjective evolutionary algorithm, and performances of three representative Paretooptimal designs were discussed compared to a reference design. In the optimal designs, higher level of uniform cooling was generally achieved with higher pressure coefficient. The Paretosensitivity analysis between the objective function and design variable was also performed. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Optimization of a Hybrid Double Side Jet Impingement Cooling System for High Power Light Emitting Diodes | |
type | Journal Paper | |
journal volume | 136 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4026536 | |
journal fristpage | 11010 | |
journal lastpage | 11010 | |
identifier eissn | 1043-7398 | |
tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001 | |
contenttype | Fulltext |