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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISExperimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element ...
Adhesion and Reliability of Epoxy/Glass Interfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of microelectronic components is profoundly influenced by the fracture resistance of the polymer/inorganic interfaces and by the progressive debonding of these interfaces in aqueous ...
Thermal Analysis of a Ceramic Package for Microelectronic Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal analysis of a ceramic microelectronic package has been performed for six configurations under prescribed free and forced convective conditions. The corresponding three-dimensional temperature ...
Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in ...
A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A thermal response model for designing a hybrid thermal energy storage (TES) heat sink is developed. The stabilization time and maximum operating (hot side) temperature-to-transition temperature ...
Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Periodic structures, that is, structures that consist of a basic pattern which is repeated multiple times, are commonplace in the electronics industry. This paper is concerned with the determination ...
Pumpless Loop for Narrow Channel and Micro-Channel Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A compact cooling system is examined which capitalizes upon fluid density differences between two vertical, parallel, interconnected tubes to achieve a pumpless cooling loop. A heat-dissipating ...
A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flat rectangular plate heat sinks are often used to cool large electronic components by the combined effects of natural convection and thermal radiation. There is, however, a paucity of rational ...
A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A detailed model of a die-up 256-pin Plastic Ball Grid Array (PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, ...
The Creep-Fatigue Interaction in Solders and Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can ...