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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISEffects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Boiling experiments were performed with FC-72 on a series of nine in-line simulated microelectronic chips in a flow channel to ascertain the effects of channel orientation on critical heat flux ...
State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The incessant improvements in IC technology have made it possible to conceptualize “information appliances” providing nearly unimaginable scalar, vector, and massively parallel information processing ...
A Physics of Failure Approach to Component Placement
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Traditionally, placement techniques have focused on improving rotability based on minimizing the total wire length between interconnected components. However, electronic card assembly (ECA) reliability, ...
A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A discipline of nonlinear dynamics (Chaos Theory), not traditionally used in the study of solder, is applied here in developing a conjectured general form for fatigue based on creep. Solder ...
Optimal Design for PPF Heat Sinks in Electronics Cooling Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed ...
Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained ...
Combined Moisture and Thermal Stresses Failure Mode in a PLCC
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A finite element analysis has been conducted to provide a new explanation for PLCC cracking during soldering and develop a working model for the cracking phenomena. The model shows that cracking ...
Oil Films on Electroplated Gold Contact Surfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study was performed to quantify the amount of oil applied to Au electroplated sample sufaces and to support friction and wear studies performed to determine the optimum metallurgy and ...
Twist-Off Testing of Solder Joint Interconnections
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we ...
Thermal Model of a Thinned-Die Cooling System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated 1. To accommodate optical probing, a seemingly elaborate cooling ...