YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • Search
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Journal of Electronic Packaging

    EISSN: 1944-7078
    ISSN: 1530-9827
    Priority: 4
    Publisher: American Society of Mechanical Engineers
    Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...

    Now showing items 31-40 of 2074

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Effects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 290
    Author(s): C. O. Gersey; I. Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Boiling experiments were performed with FC-72 on a series of nine in-line simulated microelectronic chips in a flow channel to ascertain the effects of channel orientation on critical heat flux ...
    Request PDF

    State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 257
    Author(s): Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The incessant improvements in IC technology have made it possible to conceptualize “information appliances” providing nearly unimaginable scalar, vector, and massively parallel information processing ...
    Request PDF

    A Physics of Failure Approach to Component Placement 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 305
    Author(s): M. D. Osterman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Traditionally, placement techniques have focused on improving rotability based on minimizing the total wire length between interconnected components. However, electronic card assembly (ECA) reliability, ...
    Request PDF

    A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002:;page 122
    Author(s): S. Russell; R. Caroselli; J. Mason; M. Shah
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A discipline of nonlinear dynamics (Chaos Theory), not traditionally used in the study of solder, is applied here in developing a conjectured general form for fatigue based on creep. Solder ...
    Request PDF

    Optimal Design for PPF Heat Sinks in Electronics Cooling Applications 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 410
    Author(s): Han-Ting Chen; Jenn-Tsong Horng; Po-Li Chen; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed ...
    Request PDF

    Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003:;page 31009
    Author(s): Hao, Xiaohong; Peng, Bei; Xie, Gongnan; Chen, Yi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained ...
    Request PDF

    Combined Moisture and Thermal Stresses Failure Mode in a PLCC 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004:;page 249
    Author(s): Y. Kornblum; J. C. Glaser
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A finite element analysis has been conducted to provide a new explanation for PLCC cracking during soldering and develop a working model for the cracking phenomena. The model shows that cracking ...
    Request PDF

    Oil Films on Electroplated Gold Contact Surfaces 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003:;page 236
    Author(s): R. G. Bayer; K. M. Conrow; P. A. Lazarou
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study was performed to quantify the amount of oil applied to Au electroplated sample sufaces and to support friction and wear studies performed to determine the optimum metallurgy and ...
    Request PDF

    Twist-Off Testing of Solder Joint Interconnections 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003:;page 165
    Author(s): E. Suhir
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we ...
    Request PDF

    Thermal Model of a Thinned-Die Cooling System 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 435
    Author(s): N. Boiadjieva; P. Koev
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated 1. To accommodate optical probing, a seemingly elaborate cooling ...
    Request PDF
    • 1
    • 2
    • 3
    • 4
    • 5
    • 6
    • 7
    • . . .
    • 208
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Archive

    Author

    ... View More

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian