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    Thermal Model of a Thinned-Die Cooling System

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004::page 435
    Author:
    N. Boiadjieva
    ,
    P. Koev
    DOI: 10.1115/1.1826079
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated 1. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100°C for device power up to 150 W was designed 2. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3D heat equation that governs the temperature distribution was simplified to a case of a 1D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verify—the accuracy was better than 10% over the entire temperature and power ranges.
    keyword(s): Flow (Dynamics) , Heat , Temperature , Cooling systems , Air flow , Cooling AND Heat exchangers ,
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      Thermal Model of a Thinned-Die Cooling System

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    http://yetl.yabesh.ir/yetl1/handle/yetl/129824
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    contributor authorN. Boiadjieva
    contributor authorP. Koev
    date accessioned2017-05-09T00:12:40Z
    date available2017-05-09T00:12:40Z
    date copyrightDecember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26239#435_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129824
    description abstractFor through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated 1. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100°C for device power up to 150 W was designed 2. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3D heat equation that governs the temperature distribution was simplified to a case of a 1D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verify—the accuracy was better than 10% over the entire temperature and power ranges.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Model of a Thinned-Die Cooling System
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1826079
    journal fristpage435
    journal lastpage439
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsHeat
    keywordsTemperature
    keywordsCooling systems
    keywordsAir flow
    keywordsCooling AND Heat exchangers
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian