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    Twist-Off Testing of Solder Joint Interconnections

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003::page 165
    Author:
    E. Suhir
    DOI: 10.1115/1.3226529
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we briefly discuss the merits and shortcomings of both techniques and determine the relationship between the ultimate torque and the ultimate shearing force. We also suggest a simple experimental method for the evaluation of the shearing strength of solder joints on the basis of twist-off testing. It should be emphasized that such testing can be used not only for a tentative comparative evaluation of different interconnections but as a quality control vehicle as well.
    keyword(s): Testing , Solder joints , Shearing , Vehicles , Force , Torque , Quality control , Engineers , Reliability AND Shear (Mechanics) ,
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      Twist-Off Testing of Solder Joint Interconnections

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105237
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    contributor authorE. Suhir
    date accessioned2017-05-08T23:29:43Z
    date available2017-05-08T23:29:43Z
    date copyrightSeptember, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26110#165_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105237
    description abstractTwist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we briefly discuss the merits and shortcomings of both techniques and determine the relationship between the ultimate torque and the ultimate shearing force. We also suggest a simple experimental method for the evaluation of the shearing strength of solder joints on the basis of twist-off testing. It should be emphasized that such testing can be used not only for a tentative comparative evaluation of different interconnections but as a quality control vehicle as well.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleTwist-Off Testing of Solder Joint Interconnections
    typeJournal Paper
    journal volume111
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226529
    journal fristpage165
    journal lastpage171
    identifier eissn1043-7398
    keywordsTesting
    keywordsSolder joints
    keywordsShearing
    keywordsVehicles
    keywordsForce
    keywordsTorque
    keywordsQuality control
    keywordsEngineers
    keywordsReliability AND Shear (Mechanics)
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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