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    A New Accurate Closed Form Analytical Solution for Junction Temperature of High Powered Devices

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001::page 11007
    Author:
    Ling, J. H. L.
    ,
    Tay, A. A. O.
    DOI: 10.1115/1.4026352
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The peak junction temperature has a profound effect on the operational lifetime and performance of high powered microwave devices. Although numerical analysis can help to estimate the peak junction temperature, it can be computationally expensive and time consuming when investigating the effect of the device geometry and material properties on the performance of the device. On the other hand, a closedform analytical method will allow similar studies to be done easily and quickly. Although some previous analytical solutions have been proposed, the solutions either require overlong computational times or are not so accurate. In this paper, an accurate closedform analytical solution for the junction temperature of power amplifier field effect transistors (FETs) or monolithic microwave integrated circuits (MMICs) is presented. Its derivation is based on the Green's function integral method on a point heat source developed through the method of images. Unlike most previous works, the location of the heat dissipation region is assumed to be embedded under the gate. Since it is a closedform solution, the junction temperature as well as the temperature distribution around the gate can be easily calculated. Consequently, the effect of various design parameters and material properties affecting the junction temperature of the device can be easily investigated. This work is also applicable to multifinger devices by employing superposition techniques and has been shown to agree well with both numerical and experimental results.
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      A New Accurate Closed Form Analytical Solution for Junction Temperature of High Powered Devices

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    http://yetl.yabesh.ir/yetl1/handle/yetl/154448
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    contributor authorLing, J. H. L.
    contributor authorTay, A. A. O.
    date accessioned2017-05-09T01:06:45Z
    date available2017-05-09T01:06:45Z
    date issued2014
    identifier issn1528-9044
    identifier otherep_136_01_011007.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154448
    description abstractThe peak junction temperature has a profound effect on the operational lifetime and performance of high powered microwave devices. Although numerical analysis can help to estimate the peak junction temperature, it can be computationally expensive and time consuming when investigating the effect of the device geometry and material properties on the performance of the device. On the other hand, a closedform analytical method will allow similar studies to be done easily and quickly. Although some previous analytical solutions have been proposed, the solutions either require overlong computational times or are not so accurate. In this paper, an accurate closedform analytical solution for the junction temperature of power amplifier field effect transistors (FETs) or monolithic microwave integrated circuits (MMICs) is presented. Its derivation is based on the Green's function integral method on a point heat source developed through the method of images. Unlike most previous works, the location of the heat dissipation region is assumed to be embedded under the gate. Since it is a closedform solution, the junction temperature as well as the temperature distribution around the gate can be easily calculated. Consequently, the effect of various design parameters and material properties affecting the junction temperature of the device can be easily investigated. This work is also applicable to multifinger devices by employing superposition techniques and has been shown to agree well with both numerical and experimental results.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA New Accurate Closed Form Analytical Solution for Junction Temperature of High Powered Devices
    typeJournal Paper
    journal volume136
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4026352
    journal fristpage11007
    journal lastpage11007
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001
    contenttypeFulltext
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