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    Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems

    Source: Journal of Electronic Packaging:;2025:;volume( 147 ):;issue: 003::page 31003-1
    Author:
    Kiper, Caner Ekin
    ,
    Gallego-Marcos, Ignacio
    ,
    Van Wyk, Stevin
    ,
    Akkus, Yigit
    DOI: 10.1115/1.4068209
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Loop thermosiphons (LTSs) are highly effective two-phase heat spreaders, enabling significant heat transport through passive liquid–vapor phase-change, particularly beneficial in electronics cooling. However, prior studies on LTS simulations often lack sufficient clarity regarding critical modeling assumptions—particularly the selection of mass relaxation coefficients in the Lee phase-change model—and omit detailed analysis of the interplay between key numerical and physical parameters. These gaps present challenges for thermal engineers and researchers in developing stable, reliable volume of fluid (VOF) based computational fluid dynamics (CFD) simulations. In this study, we address these issues by proposing a computational framework that systematically examines the impact of parameters such as numerical time-step, flow regime, and mass relaxation coefficient ratios on stability and convergence. By monitoring and controlling mass variation, we demonstrate stable simulations with time-steps ranging from 1 × 10−4 to 5 × 10−4 s, using both turbulent and laminar flow assumptions and density-ratio-based mass relaxation coefficients. Our findings also highlight that an explicit discretization scheme combined with Geo-Reconstruct for volume fraction calculations significantly enhances stability. This framework thus provides a clear, systematic approach to LTS VOF modeling, offering a practical “recipe” for ensuring numerical robustness and guiding thermal engineers in navigating complex simulation settings.
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      Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4308123
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    contributor authorKiper, Caner Ekin
    contributor authorGallego-Marcos, Ignacio
    contributor authorVan Wyk, Stevin
    contributor authorAkkus, Yigit
    date accessioned2025-08-20T09:20:45Z
    date available2025-08-20T09:20:45Z
    date copyright4/7/2025 12:00:00 AM
    date issued2025
    identifier issn1043-7398
    identifier otherep_147_03_031003.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4308123
    description abstractLoop thermosiphons (LTSs) are highly effective two-phase heat spreaders, enabling significant heat transport through passive liquid–vapor phase-change, particularly beneficial in electronics cooling. However, prior studies on LTS simulations often lack sufficient clarity regarding critical modeling assumptions—particularly the selection of mass relaxation coefficients in the Lee phase-change model—and omit detailed analysis of the interplay between key numerical and physical parameters. These gaps present challenges for thermal engineers and researchers in developing stable, reliable volume of fluid (VOF) based computational fluid dynamics (CFD) simulations. In this study, we address these issues by proposing a computational framework that systematically examines the impact of parameters such as numerical time-step, flow regime, and mass relaxation coefficient ratios on stability and convergence. By monitoring and controlling mass variation, we demonstrate stable simulations with time-steps ranging from 1 × 10−4 to 5 × 10−4 s, using both turbulent and laminar flow assumptions and density-ratio-based mass relaxation coefficients. Our findings also highlight that an explicit discretization scheme combined with Geo-Reconstruct for volume fraction calculations significantly enhances stability. This framework thus provides a clear, systematic approach to LTS VOF modeling, offering a practical “recipe” for ensuring numerical robustness and guiding thermal engineers in navigating complex simulation settings.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleComputational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
    typeJournal Paper
    journal volume147
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4068209
    journal fristpage31003-1
    journal lastpage31003-14
    page14
    treeJournal of Electronic Packaging:;2025:;volume( 147 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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