Browsing Journal of Electronic Packaging by Title
Now showing items 1-20 of 2074
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0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding
(The American Society of Mechanical Engineers (ASME), 1997)Resilient silicone-matrix composites containing 7–13 volume percent nickel filaments (0.4 μm diameter) exhibited 74–93 dB electromagnetic interference (EMI) shielding effectiveness at 1–2 GHz and 1 ... -
3D Compact Model of Packaged Thermoelectric Coolers
(The American Society of Mechanical Engineers (ASME), 2013)Hotspots on a microelectronic package can severely hurt the performance and longterm reliability of the chip. Thermoelectric coolers (TECs) can provide sitespecific and ondemand cooling of hot spots in microprocessors. We ... -
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
(The American Society of Mechanical Engineers (ASME), 2003)In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a ... -
40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
(The American Society of Mechanical Engineers (ASME), 2012)Copper–silver (Cu–Ag) composite flip-chip interconnect between silicon (Si) chips and Cu substrates is demonstrated. Array of Cu–Ag columns, each 28 μm in height and 40 μm in diameter, is ... -
40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
(The American Society of Mechanical Engineers (ASME), 2011)Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are ... -
A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements
(The American Society of Mechanical Engineers (ASME), 2003)Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests, measuring a thermal resistance value for a single component on a standard ... -
A Bonded Joint Analysis for Surface Mount Components
(The American Society of Mechanical Engineers (ASME), 1992)To gain a better understanding of the stress state in surface mount joints and their design considerations, an analysis method of bonded joints is developed and consequently three parameters ... -
A Brief Overview of Recent Developments in Thermal Management in Data Centers
(The American Society of Mechanical Engineers (ASME), 2015)Data centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their ... -
A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips
(The American Society of Mechanical Engineers (ASME), 2001)Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips. -
A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results
(The American Society of Mechanical Engineers (ASME), 2007)The problem of heat removal in energetic processes represents a big challenge especially because of the enhanced requirements of the modern industry. The thermal exchange systems therefore have ... -
A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
(The American Society of Mechanical Engineers (ASME), 2008)Over upcoming electronics technology nodes, shrinking feature sizes of on-chip interconnects and correspondingly higher current densities are expected to result in higher temperatures due to ... -
A Compact Modeling Approach to Enhance Collaborative Design of Thermal Fluid Systems
(The American Society of Mechanical Engineers (ASME), 2014)This paper presents an approach for reducing detailed numerical models of electronic equipment into compact thermalfluid models. These compact models have been created using network analogies representing mass, momentum ... -
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
(The American Society of Mechanical Engineers (ASME), 2024)Thermal and hydraulic performances of seven water-cooled minichannel cold plates with different internal structures are compared using numerical analysis. Recent increasing demands for high-performance computing have led ... -
A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
(The American Society of Mechanical Engineers (ASME), 2001)A detailed model of a die-up 256-pin Plastic Ball Grid Array (PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, ... -
A Comparison of Computational and Experimental Results for Flow and Heat Transfer From an Array of Heated Blocks
(The American Society of Mechanical Engineers (ASME), 1997)This paper summarizes computational results for flow and heat transfer over an array ofidealized electronic components and compares them to experimental data. The numerical modeling was performed ... -
A Comparison of Parametric and Multivariable Optimization Techniques in a Raised Floor Data Center
(The American Society of Mechanical Engineers (ASME), 2013)It is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raisedfloor height, ceiling height, and percentage ... -
A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging
(The American Society of Mechanical Engineers (ASME), 1990)The solderability of a wrought nickel pin directly overplated with gold and that of a wrought kovar (tradename of an Fe-Ni-Co alloy manufactured by Carpenter Technology Corporation) pin plated ... -
A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads
(The American Society of Mechanical Engineers (ASME), 2001)As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering ... -
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
(The American Society of Mechanical Engineers (ASME), 2023)Better understanding and control of residual stress in the chip build-up layer are becoming more and more important for the assembly process. To estimate the chip warpage and characterize the residual stress, different ... -
A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics
(The American Society of Mechanical Engineers (ASME), 2015)Seamless advancements in electronics industry resulted in high performance computing. These innovations lead to smaller electronics systems with higher heat fluxes than ever. However, shrinking nature of real estate for ...