YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    A Brief Overview of Recent Developments in Thermal Management in Data Centers

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004::page 40801
    Author:
    Alkharabsheh, Sami
    ,
    Fernandes, John
    ,
    Gebrehiwot, Betsegaw
    ,
    Agonafer, Dereje
    ,
    Ghose, Kanad
    ,
    Ortega, Alfonso
    ,
    Joshi, Yogendra
    ,
    Sammakia, Bahgat
    DOI: 10.1115/1.4031326
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Data centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their energy consumption to grow by about 10% a year continuously. The heat generated in these data centers must be removed so as to prevent high temperatures from degrading their reliability, which would cost additional energy. Therefore, precise and reliable thermal management of the data center environment is critical. This paper focuses on recent advancements in data center modeling and energy optimization. A number of currently available and developmental thermal management technology in data centers are broadly reviewed. Computational fluid dynamics (CFD) for raisedfloor data centers, experimental measurements, containment systems, economizer cooling, hybrid cooling, and device level cooling are all thoroughly reviewed. The paper concludes with a summary and presents areas of potential future research, which are based on the holistic integration of workload prediction and allocation, and thermal management using smart control systems.
    • Download: (3.919Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      A Brief Overview of Recent Developments in Thermal Management in Data Centers

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/157708
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorAlkharabsheh, Sami
    contributor authorFernandes, John
    contributor authorGebrehiwot, Betsegaw
    contributor authorAgonafer, Dereje
    contributor authorGhose, Kanad
    contributor authorOrtega, Alfonso
    contributor authorJoshi, Yogendra
    contributor authorSammakia, Bahgat
    date accessioned2017-05-09T01:17:04Z
    date available2017-05-09T01:17:04Z
    date issued2015
    identifier issn1528-9044
    identifier otherep_137_04_040801.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157708
    description abstractData centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their energy consumption to grow by about 10% a year continuously. The heat generated in these data centers must be removed so as to prevent high temperatures from degrading their reliability, which would cost additional energy. Therefore, precise and reliable thermal management of the data center environment is critical. This paper focuses on recent advancements in data center modeling and energy optimization. A number of currently available and developmental thermal management technology in data centers are broadly reviewed. Computational fluid dynamics (CFD) for raisedfloor data centers, experimental measurements, containment systems, economizer cooling, hybrid cooling, and device level cooling are all thoroughly reviewed. The paper concludes with a summary and presents areas of potential future research, which are based on the holistic integration of workload prediction and allocation, and thermal management using smart control systems.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Brief Overview of Recent Developments in Thermal Management in Data Centers
    typeJournal Paper
    journal volume137
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4031326
    journal fristpage40801
    journal lastpage40801
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian