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contributor authorAlkharabsheh, Sami
contributor authorFernandes, John
contributor authorGebrehiwot, Betsegaw
contributor authorAgonafer, Dereje
contributor authorGhose, Kanad
contributor authorOrtega, Alfonso
contributor authorJoshi, Yogendra
contributor authorSammakia, Bahgat
date accessioned2017-05-09T01:17:04Z
date available2017-05-09T01:17:04Z
date issued2015
identifier issn1528-9044
identifier otherep_137_04_040801.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157708
description abstractData centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their energy consumption to grow by about 10% a year continuously. The heat generated in these data centers must be removed so as to prevent high temperatures from degrading their reliability, which would cost additional energy. Therefore, precise and reliable thermal management of the data center environment is critical. This paper focuses on recent advancements in data center modeling and energy optimization. A number of currently available and developmental thermal management technology in data centers are broadly reviewed. Computational fluid dynamics (CFD) for raisedfloor data centers, experimental measurements, containment systems, economizer cooling, hybrid cooling, and device level cooling are all thoroughly reviewed. The paper concludes with a summary and presents areas of potential future research, which are based on the holistic integration of workload prediction and allocation, and thermal management using smart control systems.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Brief Overview of Recent Developments in Thermal Management in Data Centers
typeJournal Paper
journal volume137
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4031326
journal fristpage40801
journal lastpage40801
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004
contenttypeFulltext


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