| contributor author | John H. Lau | |
| contributor author | Stephen H. Pan | |
| date accessioned | 2017-05-09T00:09:49Z | |
| date available | 2017-05-09T00:09:49Z | |
| date copyright | December, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26225#621_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128161 | |
| description abstract | In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous chemical reaction of the Sn layer and the Sn5Cu6 layer. The Sn layer is assumed to be an elasto-plastic material. The results presented herein is useful in understanding why the compressive stress in the Sn layer can initiate a tin whisker near the weak spot of a SnOx layer. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | 3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1604805 | |
| journal fristpage | 621 | |
| journal lastpage | 624 | |
| identifier eissn | 1043-7398 | |
| keywords | Copper | |
| keywords | Stress | |
| keywords | Stress analysis (Engineering) | |
| keywords | Compressive stress AND Boundary-value problems | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004 | |
| contenttype | Fulltext | |