YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003::page 232
    Author:
    Sarang Shidore
    ,
    Tien Yu Tom Lee
    DOI: 10.1115/1.1349423
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A detailed model of a die-up 256-pin Plastic Ball Grid Array (PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, four compact models were derived; two two-resistor models (one created through a two-point computational cold plate test; the other using the DELPHI optimization approach), a multi-resistor Star network model and a shunt network model. The latter three models were derived using the methodology established by the DELPHI (Development of Libraries of Physical models for an Integrated design environment) project. The four compact models and the detailed model were each placed in natural convection and forced convection (velocities of 1,2, and 4 m/s) environments. Good agreement was obtained for the die-junction temperature rise for both the detailed and the shunt compact models. The star and two-resistor models were seen to be inferior in terms of accuracy. The two-resistor model created using the DELPHI methodology was found to be superior compared to the one created with the computational cold-plate test. The star model showed little gain in performance as compared to the DELPHI two-resistor model.
    keyword(s): Computational fluid dynamics , Forced convection , Natural convection , Optimization , Junctions , Temperature , Networks , Resistors , Ball-Grid-Array packaging , Network models AND Electrical resistance ,
    • Download: (460.7Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/125033
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorSarang Shidore
    contributor authorTien Yu Tom Lee
    date accessioned2017-05-09T00:04:35Z
    date available2017-05-09T00:04:35Z
    date copyrightSeptember, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26195#232_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125033
    description abstractA detailed model of a die-up 256-pin Plastic Ball Grid Array (PBGA) package was created and validated against experimental data for natural convection and forced convection environments. Next, four compact models were derived; two two-resistor models (one created through a two-point computational cold plate test; the other using the DELPHI optimization approach), a multi-resistor Star network model and a shunt network model. The latter three models were derived using the methodology established by the DELPHI (Development of Libraries of Physical models for an Integrated design environment) project. The four compact models and the detailed model were each placed in natural convection and forced convection (velocities of 1,2, and 4 m/s) environments. Good agreement was obtained for the die-junction temperature rise for both the detailed and the shunt compact models. The star and two-resistor models were seen to be inferior in terms of accuracy. The two-resistor model created using the DELPHI methodology was found to be superior compared to the one created with the computational cold-plate test. The star model showed little gain in performance as compared to the DELPHI two-resistor model.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
    typeJournal Paper
    journal volume123
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1349423
    journal fristpage232
    journal lastpage237
    identifier eissn1043-7398
    keywordsComputational fluid dynamics
    keywordsForced convection
    keywordsNatural convection
    keywordsOptimization
    keywordsJunctions
    keywordsTemperature
    keywordsNetworks
    keywordsResistors
    keywordsBall-Grid-Array packaging
    keywordsNetwork models AND Electrical resistance
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian