Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated TemperaturesSource: Journal of Electronic Packaging:;2024:;volume( 147 ):;issue: 001::page 11010-1Author:Shishido, Nobuyuki
,
Hayama, Yutaka
,
Akinaga, Yuki
,
Taketomi, Shinya
,
Koganemaru, Masaaki
,
Hagihara, Seiya
,
Miyazaki, Noriyuki
DOI: 10.1115/1.4066100Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff, in which an aluminum wire delaminates from a silicon chip. The wire-liftoff phenomenon is a thermal fatigue failure caused by repeated temperature cycles during the operation of power modules. According to an experimental study, the wire-liftoff lifetime decreases with increase in the maximum junction temperature of a temperature cycle, Tmax, then levels off above 200 °C of Tmax. Such a saturation phenomenon of the wire-liftoff lifetime is main concern of the present study. We select the nonlinear fracture mechanics parameter T*-integral range, as a physical quantity describing the wire-liftoff lifetime. The T*-integral range, ΔT*, is only one fracture mechanics parameter that can be applied to thermal fatigue under a cyclic thermo-elastic-plastic creep condition. We perform nonlinear finite element analyses of a power module to calculate the ΔT* based on the mathematical expression of ΔT* for various temperature cycles. As a result, the ΔT* obtained from the exact method based on the mathematical expression of ΔT* is expected to be utilized for quantitative estimation of wire-liftoff lifetime in a wide temperature range of low to high temperatures.
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contributor author | Shishido, Nobuyuki | |
contributor author | Hayama, Yutaka | |
contributor author | Akinaga, Yuki | |
contributor author | Taketomi, Shinya | |
contributor author | Koganemaru, Masaaki | |
contributor author | Hagihara, Seiya | |
contributor author | Miyazaki, Noriyuki | |
date accessioned | 2025-04-21T10:16:37Z | |
date available | 2025-04-21T10:16:37Z | |
date copyright | 8/24/2024 12:00:00 AM | |
date issued | 2024 | |
identifier issn | 1043-7398 | |
identifier other | ep_147_01_011010.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4305852 | |
description abstract | Power modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff, in which an aluminum wire delaminates from a silicon chip. The wire-liftoff phenomenon is a thermal fatigue failure caused by repeated temperature cycles during the operation of power modules. According to an experimental study, the wire-liftoff lifetime decreases with increase in the maximum junction temperature of a temperature cycle, Tmax, then levels off above 200 °C of Tmax. Such a saturation phenomenon of the wire-liftoff lifetime is main concern of the present study. We select the nonlinear fracture mechanics parameter T*-integral range, as a physical quantity describing the wire-liftoff lifetime. The T*-integral range, ΔT*, is only one fracture mechanics parameter that can be applied to thermal fatigue under a cyclic thermo-elastic-plastic creep condition. We perform nonlinear finite element analyses of a power module to calculate the ΔT* based on the mathematical expression of ΔT* for various temperature cycles. As a result, the ΔT* obtained from the exact method based on the mathematical expression of ΔT* is expected to be utilized for quantitative estimation of wire-liftoff lifetime in a wide temperature range of low to high temperatures. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures | |
type | Journal Paper | |
journal volume | 147 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4066100 | |
journal fristpage | 11010-1 | |
journal lastpage | 11010-9 | |
page | 9 | |
tree | Journal of Electronic Packaging:;2024:;volume( 147 ):;issue: 001 | |
contenttype | Fulltext |