Browsing Journal of Electronic Packaging by Issue Date
Now showing items 1-20 of 2029
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Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
(The American Society of Mechanical Engineers (ASME), 1/11/2023 )Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production ... -
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
(The American Society of Mechanical Engineers (ASME), 11/23/2022)Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in ... -
Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging
(The American Society of Mechanical Engineers (ASME), 12/9/2022 )The paper focused on the changes in microstructure and mechanical properties of the full Cu41Sn11 solder joint (Cu/Cu41Sn11/Cu) during isothermal aging at 420 °C. It was motivated by potential applications of Cu–Sn ... -
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
(The American Society of Mechanical Engineers (ASME), 12/9/2022 )Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field ... -
Combined Moisture and Thermal Stresses Failure Mode in a PLCC
(The American Society of Mechanical Engineers (ASME), 1989)A finite element analysis has been conducted to provide a new explanation for PLCC cracking during soldering and develop a working model for the cracking phenomena. The model shows that cracking ... -
Oil Films on Electroplated Gold Contact Surfaces
(The American Society of Mechanical Engineers (ASME), 1989)This study was performed to quantify the amount of oil applied to Au electroplated sample sufaces and to support friction and wear studies performed to determine the optimum metallurgy and ... -
Twist-Off Testing of Solder Joint Interconnections
(The American Society of Mechanical Engineers (ASME), 1989)Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we ... -
Component Placement for Reliability on Conductively Cooled Printed Wiring Boards
(The American Society of Mechanical Engineers (ASME), 1989)With the increased demand for highly reliable electronic equipment and limitations that make improvements to the reliability of individual components difficult to obtain, methods to improve the ... -
Lifetime Prediction of Solder Materials
(The American Society of Mechanical Engineers (ASME), 1989)Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not necessarily fit experimental data. The phenomenon can be correlated with a ... -
Buoyancy-Induced Flows and Transport
(The American Society of Mechanical Engineers (ASME), 1989) -
An Experimental Study of Natural Convection From an Array of Heated Protrusions on a Vertical Surface in Water
(The American Society of Mechanical Engineers (ASME), 1989)An experimental study of steady state and transient natural convection from a single column of eight heated, rectangular protrusions mounted on a vertical surface in water is presented. The ... -
Thermal Stress Analysis of a Bimaterial Strip Subject to an Axial Temperature Gradient
(The American Society of Mechanical Engineers (ASME), 1989)Formulas are derived for the stresses and displacements in a bimaterial strip which is subjected to a temperature gradient that varies linearly in the longitudinal direction. The solution is ... -
Thermal Stress Analysis of SMT PQFP Packages and Interconnections
(The American Society of Mechanical Engineers (ASME), 1989)An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed ... -
Automated Electronic Circuit Manufacturing Using Ink-Jet Technology
(The American Society of Mechanical Engineers (ASME), 1989)The feasibility of using ink-jet technology to write circuits on PC board material and TAB substrate has been demonstrated. Several systems were evaluated and the most successful system used ... -
The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components
(The American Society of Mechanical Engineers (ASME), 1989)The effect of variations in stream-wise spacing and component length on convection from rectangular, surface mounted components in a channel flow are reported. Component dimensions are the same ... -
Ceramic Materials for Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 1989)The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN ... -
Lead Frame and Wire Length Limitations to Bond Densification
(The American Society of Mechanical Engineers (ASME), 1989)At IC package lead counts above 100, the limiting factor for bond densification in single layer packages with gold wire interconnections shifts from pad pitch to a combination of lead tip ... -
An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water
(The American Society of Mechanical Engineers (ASME), 1989)An experimental investigation of steady state and transient natural convection from a column of eight in-line rectangular heated protrusions in a vertical channel in water is presented. Flow ... -
Handbook of Numerical Calculation in Engineering
(The American Society of Mechanical Engineers (ASME), 1989) -
Analysis of Brazing Stresses in Ceramic-Metal Joints in High-Vacuum Devices
(The American Society of Mechanical Engineers (ASME), 1989)Significant stresses are induced in brazed metal-to-ceramic joints during cool-down. Analysis of such stresses is complicated by nonlinear material behavior and uncertainties in material properties ...