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    Ceramic Materials for Electronic Packaging

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003::page 183
    Author:
    E. M. Rabinovich
    DOI: 10.1115/1.3226532
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.
    keyword(s): Ceramics , Electronic packaging , Glass ceramics , Firing (materials) , Sol-gel processing AND Packaging ,
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      Ceramic Materials for Electronic Packaging

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105240
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    contributor authorE. M. Rabinovich
    date accessioned2017-05-08T23:29:43Z
    date available2017-05-08T23:29:43Z
    date copyrightSeptember, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26110#183_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105240
    description abstractThe paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCeramic Materials for Electronic Packaging
    typeJournal Paper
    journal volume111
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226532
    journal fristpage183
    journal lastpage191
    identifier eissn1043-7398
    keywordsCeramics
    keywordsElectronic packaging
    keywordsGlass ceramics
    keywordsFiring (materials)
    keywordsSol-gel processing AND Packaging
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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