| contributor author | E. M. Rabinovich | |
| date accessioned | 2017-05-08T23:29:43Z | |
| date available | 2017-05-08T23:29:43Z | |
| date copyright | September, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26110#183_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105240 | |
| description abstract | The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Ceramic Materials for Electronic Packaging | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226532 | |
| journal fristpage | 183 | |
| journal lastpage | 191 | |
| identifier eissn | 1043-7398 | |
| keywords | Ceramics | |
| keywords | Electronic packaging | |
| keywords | Glass ceramics | |
| keywords | Firing (materials) | |
| keywords | Sol-gel processing AND Packaging | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003 | |
| contenttype | Fulltext | |
