Automated Electronic Circuit Manufacturing Using Ink-Jet TechnologySource: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 108Author:D. B. Wallace
DOI: 10.1115/1.3226514Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The feasibility of using ink-jet technology to write circuits on PC board material and TAB substrate has been demonstrated. Several systems were evaluated and the most successful system used paraffin as a resist material on a copper substrate. The copper was etched and the paraffin subsequently removed to form the conductive paths of the circuit. Line widths down to 100μm were achieved, and line widths of 50μm were shown feasible. The generation of the print pattern from a computer file illustrated the potential of coupling a circuit writing system to an electrical CAD system to provide rapid turnaround prototype circuits.
keyword(s): Inks , Manufacturing , Circuits , Copper , Paraffin wax , Engineering prototypes , Computer-aided design AND Computers ,
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| contributor author | D. B. Wallace | |
| date accessioned | 2017-05-08T23:29:45Z | |
| date available | 2017-05-08T23:29:45Z | |
| date copyright | June, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26108#108_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105257 | |
| description abstract | The feasibility of using ink-jet technology to write circuits on PC board material and TAB substrate has been demonstrated. Several systems were evaluated and the most successful system used paraffin as a resist material on a copper substrate. The copper was etched and the paraffin subsequently removed to form the conductive paths of the circuit. Line widths down to 100μm were achieved, and line widths of 50μm were shown feasible. The generation of the print pattern from a computer file illustrated the potential of coupling a circuit writing system to an electrical CAD system to provide rapid turnaround prototype circuits. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Automated Electronic Circuit Manufacturing Using Ink-Jet Technology | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226514 | |
| journal fristpage | 108 | |
| journal lastpage | 111 | |
| identifier eissn | 1043-7398 | |
| keywords | Inks | |
| keywords | Manufacturing | |
| keywords | Circuits | |
| keywords | Copper | |
| keywords | Paraffin wax | |
| keywords | Engineering prototypes | |
| keywords | Computer-aided design AND Computers | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
| contenttype | Fulltext |