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contributor authorD. B. Wallace
date accessioned2017-05-08T23:29:45Z
date available2017-05-08T23:29:45Z
date copyrightJune, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26108#108_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105257
description abstractThe feasibility of using ink-jet technology to write circuits on PC board material and TAB substrate has been demonstrated. Several systems were evaluated and the most successful system used paraffin as a resist material on a copper substrate. The copper was etched and the paraffin subsequently removed to form the conductive paths of the circuit. Line widths down to 100μm were achieved, and line widths of 50μm were shown feasible. The generation of the print pattern from a computer file illustrated the potential of coupling a circuit writing system to an electrical CAD system to provide rapid turnaround prototype circuits.
publisherThe American Society of Mechanical Engineers (ASME)
titleAutomated Electronic Circuit Manufacturing Using Ink-Jet Technology
typeJournal Paper
journal volume111
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226514
journal fristpage108
journal lastpage111
identifier eissn1043-7398
keywordsInks
keywordsManufacturing
keywordsCircuits
keywordsCopper
keywordsParaffin wax
keywordsEngineering prototypes
keywordsComputer-aided design AND Computers
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
contenttypeFulltext


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