| contributor author | A. Zubelewicz | |
| contributor author | R. Berriche | |
| contributor author | L. M. Keer | |
| contributor author | M. E. Fine | |
| date accessioned | 2017-05-08T23:29:43Z | |
| date available | 2017-05-08T23:29:43Z | |
| date copyright | September, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26110#179_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105239 | |
| description abstract | Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not necessarily fit experimental data. The phenomenon can be correlated with a change in the failure mode as follows: transgranular and mixed for higher strain ranges, and intergranular at lower strains. The present modeling incorporates these micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Lifetime Prediction of Solder Materials | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226531 | |
| journal fristpage | 179 | |
| journal lastpage | 182 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Failure | |
| keywords | Fatigue | |
| keywords | Stress AND Modeling | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003 | |
| contenttype | Fulltext | |