| contributor author | M. D. Osterman | |
| contributor author | M. Pecht | |
| date accessioned | 2017-05-08T23:29:45Z | |
| date available | 2017-05-08T23:29:45Z | |
| date copyright | June, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26108#149_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105263 | |
| description abstract | With the increased demand for highly reliable electronic equipment and limitations that make improvements to the reliability of individual components difficult to obtain, methods to improve the reliability at higher levels of packaging are being sought. This article presents the mathematical theory for improving reliability by appropriately locating components on conductively cooled printed wiring boards based on the thermal behavior of the components on the board. Placement techniques are then constructed to minimize the total failure rate of the collection of components. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Component Placement for Reliability on Conductively Cooled Printed Wiring Boards | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226521 | |
| journal fristpage | 149 | |
| journal lastpage | 156 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Printed circuit boards | |
| keywords | Packaging | |
| keywords | Electronic equipment AND Failure | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
| contenttype | Fulltext | |