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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISValidation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal ...
Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study focuses on the feature vector identification and remaining useful life (RUL) estimation of SAC305 solder alloy printed circuit boards (PCBs) of two different configurations during varying conditions of temperature ...
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The adoption of single-phase liquid immersion cooling (Sp-LIC) for Information Technology equipment provides an excellent cooling platform coupled with significant energy savings. There are, however, very limited studies ...
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic components are subject to high strain, during shock and vibration in many applications such as the automobile and aerospace. In many cases, this kind of electronic components will also be exposed to harsh ...
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The demand for wearable consumer electronics, fitness accessories, and biomedical equipment has led to the growth research and development of thin flexible batteries. Wearable equipment and other asset monitoring applications ...
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Automotive underhood electronics are subjected to high operating temperatures in the neighborhood of 150–200 °C for prolonged periods in the neighborhood of 10 yr. Consumer grade off-the-shelf electronics are designed to ...
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, ...
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six ...