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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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RISRecent Developments in Air Pumps for Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For electronics, poor thermal management could cause severe mechanical and electrical failures. Forced convective air cooling, i.e., flowing air over a hot surface, is one of the most efficient and economical solutions to ...
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ...
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates ...
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces ...
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels ...
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and ...
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As modern-day electronics develop, electronic devices become smaller, more powerful, and are expected to operate in more diverse configurations. However, the thermal control systems that help these devices maintain stable ...
Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface materials (TIMs) are an important component in electronic packaging, and there is a concerted effort to understand their reliability when used under various environmental load conditions. Previous researchers ...
Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pluggable optoelectronic transceiver modules are widely used in the fiber-optic communication infrastructure. It is essential to mitigate thermal contact resistance between the high-power optical module and its riding heat ...
Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper focuses on the influence of carrier gas flow rate (CGFR) and sheath gas flow rate (SGFR) on the quality of conductive traces printed with nanoparticle inks using aerosol jet printing (AJP). This investigation ...