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    Journal of Electronic Packaging

    EISSN: 1944-7078
    ISSN: 1530-9827
    Priority: 4
    Publisher: American Society of Mechanical Engineers
    Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...

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    Recent Developments in Air Pumps for Thermal Management of Electronics 

    Source: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 003:;page 30802-1
    Author(s): Wen, Tsrong-Yi; Ye, Jia-Cheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: For electronics, poor thermal management could cause severe mechanical and electrical failures. Forced convective air cooling, i.e., flowing air over a hot surface, is one of the most efficient and economical solutions to ...
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    A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41015-1
    Author(s): Mohsenian, Ghazal; Hoang, Cong Hiep; Nemati, Kourosh; Alissa, Hussam; Tradat, Mohammad; Fallahtafti, Najmeh; Radmard, Vahideh; Murray, Bruce; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ...
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    Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41012-1
    Author(s): Saito, Daiki; Sasagawa, Kazuhiko; Moriwaki, Takeshi; Fujisaki, Kazuhiro
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates ...
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    Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41013-1
    Author(s): Wang, Xinyue; Zeng, Zejun; Zhang, Guoqi; Zhang, Jing; Liu, Pan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces ...
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    Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41014-1
    Author(s): Gao, Zhigang; Wang, Tianhu; Yang, Yuxin; Shang, Xiaolong; Bai, Junhua; Li, Peng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels ...
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    System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041108-1
    Author(s): Nafis, Bakhtiyar Mohammad; Iradukunda, Ange-Christian; Huitink, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and ...
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    Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041105-1
    Author(s): O'Connor, Nathaniel J.; Castaneda, Alexander J.; Christidis, Pavolas N.; Vayas Tobar, Nicolas; Talmor, Michal; Yagoobi, Jamal
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As modern-day electronics develop, electronic devices become smaller, more powerful, and are expected to operate in more diverse configurations. However, the thermal control systems that help these devices maintain stable ...
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    Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 001:;page 011011-1
    Author(s): Misrak, Abel; Chauhan, Tushar; Rajmane, Pavan; Bhandari, Rabin; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal interface materials (TIMs) are an important component in electronic packaging, and there is a concerted effort to understand their reliability when used under various environmental load conditions. Previous researchers ...
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    Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003:;page 031114-1
    Author(s): Cui, Jin; Pan, Liang; Weibel, Justin A.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Pluggable optoelectronic transceiver modules are widely used in the fiber-optic communication infrastructure. It is essential to mitigate thermal contact resistance between the high-power optical module and its riding heat ...
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    Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 001:;page 011012-1
    Author(s): Dalal, Neil; Gu, Yuan; Chen, Guang; Hines, Daniel R.; Dasgupta, Abhijit; Das, Siddhartha
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper focuses on the influence of carrier gas flow rate (CGFR) and sheath gas flow rate (SGFR) on the quality of conductive traces printed with nanoparticle inks using aerosol jet printing (AJP). This investigation ...
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