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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1971-1980 of 2017
Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High porosity, high pore-density (pores per inch: PPI) metal foams are a popular choice in high heat flux cooling applications as they offer large heat transfer area over a given volume, however, accompanied by a concomitant ...
Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. ...
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The conventional capillary underfill process has been a common practice in the industry, somehow the process is costly and time-consuming. Thus, no-flow underfill process is developed to increase the effective lead time ...
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two-phase spray cooling is considered as one of the most promising thermal management techniques characterized by high heat transfer coefficient (HTC) and critical heat flux (CHF), as well as near-uniform temperatures on ...
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation ...
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Cu pillar microbumps with polymer cores have been demonstrated to effectively reduce thermomechanical stress and improve joint reliability. Fabricating polymer cores by a printing approach was proposed to overcome the ...
Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Detailed heat transfer distributions of multiple microscaled tapered jets orthogonally impinging on the surface of a high-power density silicon wall is presented. The tapered jets issued from two different impingement setup ...
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a new design architecture for mechanically flexible light-emitting diode (LED) signage modules for applications in digital advertising on curved surfaces. The new design comprises an array of commonly ...
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ninety percent of high temperature electronic devices operate in temperatures in the range of 150 to 300 °C, and for such temperature needs, technologies typical for the military range might be adapted. To make it possible, ...
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigated the effect of heat spreading on the boiling of the Novec 649™ for two-phase immersion cooling of electronics. Reference pool boiling tests were performed by attaching a 25.4 mm by 25.4 mm square ...