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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1991-2000 of 2029
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ...
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ...
Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Rapid detection of hardware Trojans on a semiconductor chip that may run malicious processes on the chip is a critical and ongoing security need. Several approaches have been investigated in the past for hardware Trojan ...
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling ...
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and ...
Modular Heat Sinks for Enhanced Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power electronics are vital for the generation, conversion, transmission, and distribution of electrical energy. Improving the efficiency, power density, and reliability of power electronics is an important challenge that ...
Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Conducting traces on a flexible substrate often have to survive significant and repeated deformation, making their fatigue resistance and the stability of it during long-term storage and use a potential concern. The question ...
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Alumina-based die-attach and encapsulation for high-temperature (300–500 °C) electronic packaging were investigated. The alumina paste material comprises aluminum dihydric phosphate as a binder and alumina powder as a ...
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ...
Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Data centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on ...