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    Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003::page 031001-1
    Author:
    Kasukurthy, Rajesh
    ,
    Rachakonda, Amruthavalli
    ,
    Agonafer, Dereje
    DOI: 10.1115/1.4049018
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Data centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on thermal engineers to develop efficient methods in order to minimize the expenditure at least toward cooling considering the limited available power resources. One of the key areas where electronic cooling research has been focusing, is addressing the issue of nonuniform power distribution at the rack, server and even at package levels. Nonuniform heating at the chip level creates hotspots and temperature gradients across the chip which in turn significantly increases the cost of cooling, as cooling cost is a function of the maximum junction temperature. This challenge has increased the use of temperature sensing mechanisms to help in finding ways to mitigate the gradients. A very effective way to conserve pumping power and address hotspots on the single or multichip modules is by targeted delivery of liquid coolant. One way to enable such targeted delivery of coolant is by using dynamic cold plates coupled with self-regulating flow control device that can control flow rate based on temperature. This novel technology will have more effective implementation coupled with a good control strategy. This paper addresses the development and testing of such control strategy with minimal sensors along with less latency and optimization of the same.
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      Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4277157
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    contributor authorKasukurthy, Rajesh
    contributor authorRachakonda, Amruthavalli
    contributor authorAgonafer, Dereje
    date accessioned2022-02-05T22:13:29Z
    date available2022-02-05T22:13:29Z
    date copyright1/19/2021 12:00:00 AM
    date issued2021
    identifier issn1043-7398
    identifier otherep_143_03_031001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4277157
    description abstractData centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on thermal engineers to develop efficient methods in order to minimize the expenditure at least toward cooling considering the limited available power resources. One of the key areas where electronic cooling research has been focusing, is addressing the issue of nonuniform power distribution at the rack, server and even at package levels. Nonuniform heating at the chip level creates hotspots and temperature gradients across the chip which in turn significantly increases the cost of cooling, as cooling cost is a function of the maximum junction temperature. This challenge has increased the use of temperature sensing mechanisms to help in finding ways to mitigate the gradients. A very effective way to conserve pumping power and address hotspots on the single or multichip modules is by targeted delivery of liquid coolant. One way to enable such targeted delivery of coolant is by using dynamic cold plates coupled with self-regulating flow control device that can control flow rate based on temperature. This novel technology will have more effective implementation coupled with a good control strategy. This paper addresses the development and testing of such control strategy with minimal sensors along with less latency and optimization of the same.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDesign and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
    typeJournal Paper
    journal volume143
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4049018
    journal fristpage031001-1
    journal lastpage031001-5
    page5
    treeJournal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian