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    Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 002::page 020904-1
    Author:
    Ramakrishnan, Bharath
    ,
    Hoang, Cong Hiep
    ,
    Khalili, Sadegh
    ,
    Hadad, Yaser
    ,
    Rangarajan, Srikanth
    ,
    Pattamatta, Arvind
    ,
    Sammakia, Bahgat
    DOI: 10.1115/1.4049928
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling heat transfer technique is widely believed to address the heating problem posed by HPC racks. In this study, a novel liquid-cooled cold plate containing microchannel and jet impingement arrangement was characterized for its two-phase flow and thermal behavior. A sophisticated bench top setup involving a mock package was developed to carry out the experiments in a controlled fashion using a dielectric fluid Novec/HFE-7000. Two-phase flow boiling in cold plates which has a strong dependency on surface phenomena were carefully studied at various levels of inlet pressure, subcooling, flow rates, and heat flux levels to the mock package. A resistance network was invoked to determine the average heat transfer coefficient at various exit qualities estimated by the energy balance equation. While the results make it evident that, the high heat generating components can be kept at operable conditions using the two-phase cooling; a deeper insight at the outcomes could pave way for more energy efficient cold plate designs. The experiment was carried out with a large heated surface of 6.45 cm2 and maximum dissipated heat flux was around 63.6 W/cm2 corresponding to chip power of 410 W. Base temperature was kept below 75 °C and pressure drop did not exceed 21 kPa.
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      Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4277152
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    contributor authorRamakrishnan, Bharath
    contributor authorHoang, Cong Hiep
    contributor authorKhalili, Sadegh
    contributor authorHadad, Yaser
    contributor authorRangarajan, Srikanth
    contributor authorPattamatta, Arvind
    contributor authorSammakia, Bahgat
    date accessioned2022-02-05T22:13:19Z
    date available2022-02-05T22:13:19Z
    date copyright3/5/2021 12:00:00 AM
    date issued2021
    identifier issn1043-7398
    identifier otherep_143_02_020904.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4277152
    description abstractHigh-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling heat transfer technique is widely believed to address the heating problem posed by HPC racks. In this study, a novel liquid-cooled cold plate containing microchannel and jet impingement arrangement was characterized for its two-phase flow and thermal behavior. A sophisticated bench top setup involving a mock package was developed to carry out the experiments in a controlled fashion using a dielectric fluid Novec/HFE-7000. Two-phase flow boiling in cold plates which has a strong dependency on surface phenomena were carefully studied at various levels of inlet pressure, subcooling, flow rates, and heat flux levels to the mock package. A resistance network was invoked to determine the average heat transfer coefficient at various exit qualities estimated by the energy balance equation. While the results make it evident that, the high heat generating components can be kept at operable conditions using the two-phase cooling; a deeper insight at the outcomes could pave way for more energy efficient cold plate designs. The experiment was carried out with a large heated surface of 6.45 cm2 and maximum dissipated heat flux was around 63.6 W/cm2 corresponding to chip power of 410 W. Base temperature was kept below 75 °C and pressure drop did not exceed 21 kPa.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleExperimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
    typeJournal Paper
    journal volume143
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4049928
    journal fristpage020904-1
    journal lastpage020904-11
    page11
    treeJournal of Electronic Packaging:;2021:;volume( 143 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian