| contributor author | Cheng, Hsien-Chie | |
| contributor author | Liu, Yan-Cheng | |
| date accessioned | 2024-04-24T22:21:58Z | |
| date available | 2024-04-24T22:21:58Z | |
| date copyright | 10/5/2023 12:00:00 AM | |
| date issued | 2023 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_146_01_017002.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4295081 | |
| description abstract | An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005) | |
| type | Journal Paper | |
| journal volume | 146 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4063546 | |
| journal fristpage | 17002-1 | |
| journal lastpage | 17002-1 | |
| page | 1 | |
| tree | Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 001 | |
| contenttype | Fulltext | |