contributor author | Khalid, R. | |
contributor author | Youssef, E. | |
contributor author | Amalfi, R. L. | |
contributor author | Ortega, A. | |
contributor author | Wemhoff, A. P. | |
date accessioned | 2024-04-24T22:21:59Z | |
date available | 2024-04-24T22:21:59Z | |
date copyright | 11/10/2023 12:00:00 AM | |
date issued | 2023 | |
identifier issn | 1043-7398 | |
identifier other | ep_146_02_021005.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4295082 | |
description abstract | A thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger (HX), where air is cooled by evaporating refrigerant. This work builds on a previously published two-dimensional (2D) model for the finned-tube HX by updating and validating the model using in-house experimental data collected from the proposed system using R1233zd(E) as the working fluid. The results show that key system variables such as refrigerant outlet quality, air and refrigerant outlet temperatures, and exchanger duty agree within 20% of their experimental counterparts. The validated model is then used to predict the mean heat transfer coefficient on the refrigerant side for each tube in the direction of airflow, indicating a maximum heat transfer coefficient of nearly 1200 W/(m2 K) for a HX duty of 5.3 kW among the tested cases. The validated model therefore enables accurate predictions of HX performance and provides insights into improving the heat exchange efficiency and the corresponding system performance. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling | |
type | Journal Paper | |
journal volume | 146 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4063252 | |
journal fristpage | 21005-1 | |
journal lastpage | 21005-17 | |
page | 17 | |
tree | Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 002 | |
contenttype | Fulltext | |