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contributor authorKhalid, R.
contributor authorYoussef, E.
contributor authorAmalfi, R. L.
contributor authorOrtega, A.
contributor authorWemhoff, A. P.
date accessioned2024-04-24T22:21:59Z
date available2024-04-24T22:21:59Z
date copyright11/10/2023 12:00:00 AM
date issued2023
identifier issn1043-7398
identifier otherep_146_02_021005.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4295082
description abstractA thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger (HX), where air is cooled by evaporating refrigerant. This work builds on a previously published two-dimensional (2D) model for the finned-tube HX by updating and validating the model using in-house experimental data collected from the proposed system using R1233zd(E) as the working fluid. The results show that key system variables such as refrigerant outlet quality, air and refrigerant outlet temperatures, and exchanger duty agree within 20% of their experimental counterparts. The validated model is then used to predict the mean heat transfer coefficient on the refrigerant side for each tube in the direction of airflow, indicating a maximum heat transfer coefficient of nearly 1200 W/(m2 K) for a HX duty of 5.3 kW among the tested cases. The validated model therefore enables accurate predictions of HX performance and provides insights into improving the heat exchange efficiency and the corresponding system performance.
publisherThe American Society of Mechanical Engineers (ASME)
titleValidation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
typeJournal Paper
journal volume146
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4063252
journal fristpage21005-1
journal lastpage21005-17
page17
treeJournal of Electronic Packaging:;2023:;volume( 146 ):;issue: 002
contenttypeFulltext


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