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ASME ( American Society of Mechanical Engineers )
Description: The American Society of Mechanical Engineers (ASME) is a professional association that, in its own words, "promotes the art, science, and practice of multidisciplinary engineering and allied sciences around the globe" via "continuing education, training and professional development, codes and standards, research, conferences and publications, government relations, and other forms of outreach." ASME is thus an engineering society, a standards organization, a research and development organization, a lobbying organization, a provider of training and education, and a nonprofit organization. Founded as an engineering society focused on mechanical engineering in North America, ASME is today multidisciplinary and global.
Now showing items 71-80 of 2029
Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion
Publisher: The American Society of Mechanical Engineers (ASME)
Mechanical Behavior of Flip-Chip Encapsulants
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Requirements for the mechanical properties of the encapsulation material in a flip-chip design to prevent the solder and the encapsulation material itself from failure are presented on the basis ...
Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical simulation of the fluid and heat transfer characteristics of electronic modules mounted on circuit boards is performed using a commercial finite-control-volume code, PHOENICS. The model ...
Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Enhancements to thermal performance of FC-PBGA packages due to underfill thermal conductivity, controlled collapse chip connection (C4) pitch, package to printed wiring board (PWB) interconnection ...
Flow and Heat Transfer Analysis of an Electro Osmotic Flow Micropump for Chip Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports theoretical and numerical analysis of fluid flow and heat transfer in a cascade electroosmotic flow (EOF) micropump for chip cooling. A simple analytical model is developed to determine the temperature ...
Solder Joint Reliability of Surface Mount Connectors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the ...
Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. ...
Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The need for compact models for ICs is a well-recognized problem in electronics cooling simulations of systems containing multiple PCBs and many devices per board. The disparate length scales ...
Thermal Performance of a Water Cooled Microchannel Heat Sink With Grooves and Obstacles
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has become a favor cooling ...
Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from ...