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ASME ( American Society of Mechanical Engineers )
Description: The American Society of Mechanical Engineers (ASME) is a professional association that, in its own words, "promotes the art, science, and practice of multidisciplinary engineering and allied sciences around the globe" via "continuing education, training and professional development, codes and standards, research, conferences and publications, government relations, and other forms of outreach." ASME is thus an engineering society, a standards organization, a research and development organization, a lobbying organization, a provider of training and education, and a nonprofit organization. Founded as an engineering society focused on mechanical engineering in North America, ASME is today multidisciplinary and global.
Now showing items 51-60 of 2029
A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental ...
An Integral Heat Sink for Cooling Microelectronic Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Liquid immersion cooling is rapidly becoming the mechanism of choice for the newest generation of supercomputers. Miniaturization at both the chip and module level places a severe constraint on ...
Finding the Constitutive Relation for a Specific Elastomer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The main purpose of this study was to determine a suitable strain energy function for a specific elastomer. A survey of various strain energy functions proposed in the past was made. For ...
Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper ...
Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments were conducted to study the flow and heat transfer characteristics of a natural circulation liquid cooling system for electronic components. The test loop consisted of a horizontal ...
Effect of Through Silicon Via Joule Heating on Device Performance for Low Powered Mobile Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) throughsiliconvia (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous ...
High Frequency and Low Temperature Thermosonic Bonding of Lead Free Microsolder Ball on Silver Pad Without Flux
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadfree solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz highfrequency ...
A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: When modeling the thermomechanical behavior of electronic packages, engineers often need to include the temperature dependence of coefficients of thermal expansion (CTE) of materials involved in ...
Wetting Dynamics of Molten Solder Alloys on Metal Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Preliminary results from solderability studies are used to elucidate the physicochemical aspects of solderability, in particular the relationship between liquid composition and wetting. Spreading ...
Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Isothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based ...