contributor author | Wang, Fuliang | |
contributor author | Li, Junhui | |
contributor author | Han, Lei | |
date accessioned | 2017-05-09T01:06:49Z | |
date available | 2017-05-09T01:06:49Z | |
date issued | 2014 | |
identifier issn | 1528-9044 | |
identifier other | ep_136_03_031001.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/154472 | |
description abstract | Leadfree solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz highfrequency thermosonic bonding method is proposed and realized using a lab bonder. Experimental results showed that this method could be used to bond a 300 خ¼mdiameter Sn–Ag–0.5Cu microsolder ball onto a silver pad without flux at a low temperature of 160 آ°C in 3 s. A ball shear test showed that the high frequency led to a high bonding strength of 58.8 MPa, and a dimpled structure was observed at the bonding interface by SEM. Compare with the reflow method or laser soldering method, the proposed method requires a low bonding temperature and leads to a high bonding strength. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | High Frequency and Low Temperature Thermosonic Bonding of Lead Free Microsolder Ball on Silver Pad Without Flux | |
type | Journal Paper | |
journal volume | 136 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4026877 | |
journal fristpage | 31001 | |
journal lastpage | 31001 | |
identifier eissn | 1043-7398 | |
tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003 | |
contenttype | Fulltext | |