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    A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004::page 470
    Author:
    Yi-Hsin Pao
    ,
    Edward Jih
    ,
    Bruce E. Artz
    ,
    Larry W. Cathey
    DOI: 10.1115/1.2905483
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: When modeling the thermomechanical behavior of electronic packages, engineers often need to include the temperature dependence of coefficients of thermal expansion (CTE) of materials involved in the finite element model. In ABAQUS some input parameters associated with such temperature dependent CTE are not clearly defined, and directions to determine the value of these parameters are not given. Misinterpretation of these variables can result in serious errors in the finite element result. This brief tends to illustrate in detail the implementation steps of the temperature dependent CTE in ABAQUS and presents an error analysis so that a quantitative measure of the error can be obtained. The information presented here is regarded critical to those who are using ABAQUS with temperature dependent CTE.
    keyword(s): Thermal expansion , Temperature , Errors , Finite element model , Electronic packages , Engineers , Finite element analysis , Modeling AND Error analysis ,
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      A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110037
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    • Journal of Electronic Packaging

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    contributor authorYi-Hsin Pao
    contributor authorEdward Jih
    contributor authorBruce E. Artz
    contributor authorLarry W. Cathey
    date accessioned2017-05-08T23:38:05Z
    date available2017-05-08T23:38:05Z
    date copyrightDecember, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26133#470_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110037
    description abstractWhen modeling the thermomechanical behavior of electronic packages, engineers often need to include the temperature dependence of coefficients of thermal expansion (CTE) of materials involved in the finite element model. In ABAQUS some input parameters associated with such temperature dependent CTE are not clearly defined, and directions to determine the value of these parameters are not given. Misinterpretation of these variables can result in serious errors in the finite element result. This brief tends to illustrate in detail the implementation steps of the temperature dependent CTE in ABAQUS and presents an error analysis so that a quantitative measure of the error can be obtained. The information presented here is regarded critical to those who are using ABAQUS with temperature dependent CTE.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
    typeJournal Paper
    journal volume114
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905483
    journal fristpage470
    journal lastpage472
    identifier eissn1043-7398
    keywordsThermal expansion
    keywordsTemperature
    keywordsErrors
    keywordsFinite element model
    keywordsElectronic packages
    keywordsEngineers
    keywordsFinite element analysis
    keywordsModeling AND Error analysis
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian