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contributor authorYi-Hsin Pao
contributor authorEdward Jih
contributor authorBruce E. Artz
contributor authorLarry W. Cathey
date accessioned2017-05-08T23:38:05Z
date available2017-05-08T23:38:05Z
date copyrightDecember, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26133#470_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110037
description abstractWhen modeling the thermomechanical behavior of electronic packages, engineers often need to include the temperature dependence of coefficients of thermal expansion (CTE) of materials involved in the finite element model. In ABAQUS some input parameters associated with such temperature dependent CTE are not clearly defined, and directions to determine the value of these parameters are not given. Misinterpretation of these variables can result in serious errors in the finite element result. This brief tends to illustrate in detail the implementation steps of the temperature dependent CTE in ABAQUS and presents an error analysis so that a quantitative measure of the error can be obtained. The information presented here is regarded critical to those who are using ABAQUS with temperature dependent CTE.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
typeJournal Paper
journal volume114
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905483
journal fristpage470
journal lastpage472
identifier eissn1043-7398
keywordsThermal expansion
keywordsTemperature
keywordsErrors
keywordsFinite element model
keywordsElectronic packages
keywordsEngineers
keywordsFinite element analysis
keywordsModeling AND Error analysis
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004
contenttypeFulltext


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