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    Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002::page 145
    Author:
    Q. Guo
    ,
    E. C. Cutiongco
    ,
    L. M. Keer
    ,
    M. E. Fine
    DOI: 10.1115/1.2906411
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Isothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based on the suggested failure criterion, load drop per cycle, the Young’s modulus and the ratio of the maximum tensile to maximum compressive stresses remain constant, and the fatigue response of the solder is stable before failure, although cyclic softening was observed from the beginning. Experimental results of isothermal fatigue tests for a total strain range from 0.3 to 3 percent show that the log-log plot of the number of cycles to failure versus the plastic strain range has a kink at the point where the elastic strain is approximately equal to the plastic strain. In this paper, it is shown how the isothermal fatigue life of near-eutectic solder at lower strain ranges can be predicted by using the experimental data of fatigue tests at high strain ranges and early stage information of a fatigue test at the strain range in question. A thermomechanical fatigue life prediction is also given based on a dislocation pile-up model. Comparison with experimental results shows a good agreement.
    keyword(s): Solders , Fatigue life , Failure , Fatigue testing , Fatigue , Cycles , Dislocations , Elasticity , Stress , Drops AND Compressive stress ,
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      Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

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    http://yetl.yabesh.ir/yetl1/handle/yetl/110069
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    contributor authorQ. Guo
    contributor authorE. C. Cutiongco
    contributor authorL. M. Keer
    contributor authorM. E. Fine
    date accessioned2017-05-08T23:38:07Z
    date available2017-05-08T23:38:07Z
    date copyrightJune, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26129#145_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110069
    description abstractIsothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based on the suggested failure criterion, load drop per cycle, the Young’s modulus and the ratio of the maximum tensile to maximum compressive stresses remain constant, and the fatigue response of the solder is stable before failure, although cyclic softening was observed from the beginning. Experimental results of isothermal fatigue tests for a total strain range from 0.3 to 3 percent show that the log-log plot of the number of cycles to failure versus the plastic strain range has a kink at the point where the elastic strain is approximately equal to the plastic strain. In this paper, it is shown how the isothermal fatigue life of near-eutectic solder at lower strain ranges can be predicted by using the experimental data of fatigue tests at high strain ranges and early stage information of a fatigue test at the strain range in question. A thermomechanical fatigue life prediction is also given based on a dislocation pile-up model. Comparison with experimental results shows a good agreement.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
    typeJournal Paper
    journal volume114
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2906411
    journal fristpage145
    journal lastpage151
    identifier eissn1043-7398
    keywordsSolders
    keywordsFatigue life
    keywordsFailure
    keywordsFatigue testing
    keywordsFatigue
    keywordsCycles
    keywordsDislocations
    keywordsElasticity
    keywordsStress
    keywordsDrops AND Compressive stress
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
    contenttypeFulltext
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