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contributor authorQ. Guo
contributor authorE. C. Cutiongco
contributor authorL. M. Keer
contributor authorM. E. Fine
date accessioned2017-05-08T23:38:07Z
date available2017-05-08T23:38:07Z
date copyrightJune, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26129#145_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110069
description abstractIsothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based on the suggested failure criterion, load drop per cycle, the Young’s modulus and the ratio of the maximum tensile to maximum compressive stresses remain constant, and the fatigue response of the solder is stable before failure, although cyclic softening was observed from the beginning. Experimental results of isothermal fatigue tests for a total strain range from 0.3 to 3 percent show that the log-log plot of the number of cycles to failure versus the plastic strain range has a kink at the point where the elastic strain is approximately equal to the plastic strain. In this paper, it is shown how the isothermal fatigue life of near-eutectic solder at lower strain ranges can be predicted by using the experimental data of fatigue tests at high strain ranges and early stage information of a fatigue test at the strain range in question. A thermomechanical fatigue life prediction is also given based on a dislocation pile-up model. Comparison with experimental results shows a good agreement.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
typeJournal Paper
journal volume114
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2906411
journal fristpage145
journal lastpage151
identifier eissn1043-7398
keywordsSolders
keywordsFatigue life
keywordsFailure
keywordsFatigue testing
keywordsFatigue
keywordsCycles
keywordsDislocations
keywordsElasticity
keywordsStress
keywordsDrops AND Compressive stress
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
contenttypeFulltext


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