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ASME ( American Society of Mechanical Engineers )
Description: The American Society of Mechanical Engineers (ASME) is a professional association that, in its own words, "promotes the art, science, and practice of multidisciplinary engineering and allied sciences around the globe" via "continuing education, training and professional development, codes and standards, research, conferences and publications, government relations, and other forms of outreach." ASME is thus an engineering society, a standards organization, a research and development organization, a lobbying organization, a provider of training and education, and a nonprofit organization. Founded as an engineering society focused on mechanical engineering in North America, ASME is today multidisciplinary and global.
Now showing items 2021-2029 of 2029
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a highly competitive and demanding micro-electronics market, non-destructive testing (NDT) technology has been widely applied to defect detection and evaluation of micro-electronic packaging. However, the trend of ...
Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the complex structure and thermal mismatch of coaxial through silicon via (TSV), cracks easily occur under thermal load, leading to interface delamination or spalling failure. The reliability issue of coaxial TSV ...
Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Modern electronics reliability prediction models require materials-specific failure data across a range of conditions. Garofalo models are preferred due to their ability to accurately predict performance over a wide ...
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed Circuit Board (PCB) is one of the most important components of electronic products. But the traditional defect detection methods are gradually difficult to meet the requirements of PCB defect detection. The research ...
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Better understanding and control of residual stress in the chip build-up layer are becoming more and more important for the assembly process. To estimate the chip warpage and characterize the residual stress, different ...
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For the first time, finite element analysis (FEA) is applied to the thermal-compression flip-chip process in micro-electronics. By adding the bump height nonuniformity and the morphology variance, a common basal line is ...
Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The survivability and reliability of commercial electronic components under very high thermo-mechanical loads are improved using underfilling and potting methods. Potting protects from operating conditions such as moisture, ...
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field ...
Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production ...