YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 003::page 30801-1
    Author:
    Chen, Yuan
    ,
    Wang, Zhongyang
    ,
    Fan, Yuhui
    ,
    Dong, Ming
    ,
    Liu, Dengxue
    DOI: 10.1115/1.4064361
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In a highly competitive and demanding micro-electronics market, non-destructive testing (NDT) technology has been widely applied to defect detection and evaluation of micro-electronic packaging. However, the trend of micro-electronic packaging toward miniaturization, high-density, ultrathin, ultralight, and with small chip footprint, poses an urgent demand for novel NDT methods with high-resolution and large penetration depth, which is utilized for internal defect detection and identification of advanced complicated packages. The conventional NDT methods for micro-electronic packaging mainly include optical visual inspection, X-ray inspection, active infrared thermography, scanning acoustic microscopy (SAM), atomic force microscopy (AFM), laser Doppler vibration measuring technique, scanning SQUID microscopy (SSM), electrical impedance spectroscopy, scanning electron microscope (SEM), and so on. This paper aims to provide a review of addressing their basic principles, advantages, limitations, and application researches in the field of defect inspection of micro-electronic packaging. Moreover, in order to overcome the shortcomings of the existing NDT methods, this paper emphasizes a novel NDT approach, called hybrid ultrasonic-laser digital holographic microscopy (DHM) imaging inspection method, and discusses its basic principle, merits, key techniques, system construction, and experimental results in detail. When some key technical problems can be solved in further research, this method will become a potentially promising technique for defect detection and evaluation of advanced complicated packages.
    • Download: (3.141Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4295088
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorChen, Yuan
    contributor authorWang, Zhongyang
    contributor authorFan, Yuhui
    contributor authorDong, Ming
    contributor authorLiu, Dengxue
    date accessioned2024-04-24T22:22:16Z
    date available2024-04-24T22:22:16Z
    date copyright3/8/2024 12:00:00 AM
    date issued2024
    identifier issn1043-7398
    identifier otherep_146_03_030801.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4295088
    description abstractIn a highly competitive and demanding micro-electronics market, non-destructive testing (NDT) technology has been widely applied to defect detection and evaluation of micro-electronic packaging. However, the trend of micro-electronic packaging toward miniaturization, high-density, ultrathin, ultralight, and with small chip footprint, poses an urgent demand for novel NDT methods with high-resolution and large penetration depth, which is utilized for internal defect detection and identification of advanced complicated packages. The conventional NDT methods for micro-electronic packaging mainly include optical visual inspection, X-ray inspection, active infrared thermography, scanning acoustic microscopy (SAM), atomic force microscopy (AFM), laser Doppler vibration measuring technique, scanning SQUID microscopy (SSM), electrical impedance spectroscopy, scanning electron microscope (SEM), and so on. This paper aims to provide a review of addressing their basic principles, advantages, limitations, and application researches in the field of defect inspection of micro-electronic packaging. Moreover, in order to overcome the shortcomings of the existing NDT methods, this paper emphasizes a novel NDT approach, called hybrid ultrasonic-laser digital holographic microscopy (DHM) imaging inspection method, and discusses its basic principle, merits, key techniques, system construction, and experimental results in detail. When some key technical problems can be solved in further research, this method will become a potentially promising technique for defect detection and evaluation of advanced complicated packages.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleResearch Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
    typeJournal Paper
    journal volume146
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4064361
    journal fristpage30801-1
    journal lastpage30801-13
    page13
    treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian