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    Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 003::page 31008-1
    Author:
    Stang, E.
    ,
    Lesko, C.
    ,
    Young, D.
    DOI: 10.1115/1.4064751
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Modern electronics reliability prediction models require materials-specific failure data across a range of conditions. Garofalo models are preferred due to their ability to accurately predict performance over a wide temperature range. However, data on intermediate solders are sparse, especially regarding performance at cold temperatures. We report Garofalo creep data for 83Pb/10Sb/5Sn/2Ag (Indalloy 236) and 91.5Sn/8.5Sb (Indalloy 264). Indalloy 236 exhibits an activation energy of 54.5 kJ/mol, n = 4.5, and α = 0.043 while Indalloy 264 exhibits an activation energy of 70.04 kJ/mol, n = 2.705, and α = 0.099 from −20 °C to 175 °C. We show that modern curve-fitting analysis should be utilized for Garofalo analysis rather than traditional linearization methods. X-ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS) were used to characterize the changes in the alloy phases during testing. Microstructural analysis indicates that Indalloy 236 can experience void coalescence at high temperatures while Indalloy 264 precipitates antimony-rich phases on the grain boundaries.
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      Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

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    contributor authorStang, E.
    contributor authorLesko, C.
    contributor authorYoung, D.
    date accessioned2024-04-24T22:22:21Z
    date available2024-04-24T22:22:21Z
    date copyright3/13/2024 12:00:00 AM
    date issued2024
    identifier issn1043-7398
    identifier otherep_146_03_031008.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4295091
    description abstractModern electronics reliability prediction models require materials-specific failure data across a range of conditions. Garofalo models are preferred due to their ability to accurately predict performance over a wide temperature range. However, data on intermediate solders are sparse, especially regarding performance at cold temperatures. We report Garofalo creep data for 83Pb/10Sb/5Sn/2Ag (Indalloy 236) and 91.5Sn/8.5Sb (Indalloy 264). Indalloy 236 exhibits an activation energy of 54.5 kJ/mol, n = 4.5, and α = 0.043 while Indalloy 264 exhibits an activation energy of 70.04 kJ/mol, n = 2.705, and α = 0.099 from −20 °C to 175 °C. We show that modern curve-fitting analysis should be utilized for Garofalo analysis rather than traditional linearization methods. X-ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS) were used to characterize the changes in the alloy phases during testing. Microstructural analysis indicates that Indalloy 236 can experience void coalescence at high temperatures while Indalloy 264 precipitates antimony-rich phases on the grain boundaries.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleConstant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
    typeJournal Paper
    journal volume146
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4064751
    journal fristpage31008-1
    journal lastpage31008-7
    page7
    treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 003
    contenttypeFulltext
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