contributor author | Stang, E. | |
contributor author | Lesko, C. | |
contributor author | Young, D. | |
date accessioned | 2024-04-24T22:22:21Z | |
date available | 2024-04-24T22:22:21Z | |
date copyright | 3/13/2024 12:00:00 AM | |
date issued | 2024 | |
identifier issn | 1043-7398 | |
identifier other | ep_146_03_031008.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4295091 | |
description abstract | Modern electronics reliability prediction models require materials-specific failure data across a range of conditions. Garofalo models are preferred due to their ability to accurately predict performance over a wide temperature range. However, data on intermediate solders are sparse, especially regarding performance at cold temperatures. We report Garofalo creep data for 83Pb/10Sb/5Sn/2Ag (Indalloy 236) and 91.5Sn/8.5Sb (Indalloy 264). Indalloy 236 exhibits an activation energy of 54.5 kJ/mol, n = 4.5, and α = 0.043 while Indalloy 264 exhibits an activation energy of 70.04 kJ/mol, n = 2.705, and α = 0.099 from −20 °C to 175 °C. We show that modern curve-fitting analysis should be utilized for Garofalo analysis rather than traditional linearization methods. X-ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS) were used to characterize the changes in the alloy phases during testing. Microstructural analysis indicates that Indalloy 236 can experience void coalescence at high temperatures while Indalloy 264 precipitates antimony-rich phases on the grain boundaries. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials | |
type | Journal Paper | |
journal volume | 146 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4064751 | |
journal fristpage | 31008-1 | |
journal lastpage | 31008-7 | |
page | 7 | |
tree | Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 003 | |
contenttype | Fulltext | |