| contributor author | D. B. Barker | |
| contributor author | Y. S. Chen | |
| contributor author | A. Dasgupta | |
| date accessioned | 2017-05-08T23:41:02Z | |
| date available | 2017-05-08T23:41:02Z | |
| date copyright | June, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26137#195_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111777 | |
| description abstract | This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. A simple approximate stress analysis is presented that does not require complex finite element modeling, nor does it reduce the problem to a simple empirical equation or rule of thumb. The goal of the new method is to make PWB vibration solder joint reliability information available to the designer as early as possible and in an easily understood and implemented manner. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909317 | |
| journal fristpage | 195 | |
| journal lastpage | 200 | |
| identifier eissn | 1043-7398 | |
| keywords | Vibration | |
| keywords | Fatigue life | |
| keywords | Surface mount components | |
| keywords | Solder joints | |
| keywords | Printed circuit boards | |
| keywords | Equations | |
| keywords | Reliability | |
| keywords | Stress analysis (Engineering) | |
| keywords | Finite element analysis AND Modeling | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002 | |
| contenttype | Fulltext | |