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contributor authorD. B. Barker
contributor authorY. S. Chen
contributor authorA. Dasgupta
date accessioned2017-05-08T23:41:02Z
date available2017-05-08T23:41:02Z
date copyrightJune, 1993
date issued1993
identifier issn1528-9044
identifier otherJEPAE4-26137#195_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111777
description abstractThis paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. A simple approximate stress analysis is presented that does not require complex finite element modeling, nor does it reduce the problem to a simple empirical equation or rule of thumb. The goal of the new method is to make PWB vibration solder joint reliability information available to the designer as early as possible and in an easily understood and implemented manner.
publisherThe American Society of Mechanical Engineers (ASME)
titleEstimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
typeJournal Paper
journal volume115
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2909317
journal fristpage195
journal lastpage200
identifier eissn1043-7398
keywordsVibration
keywordsFatigue life
keywordsSurface mount components
keywordsSolder joints
keywordsPrinted circuit boards
keywordsEquations
keywordsReliability
keywordsStress analysis (Engineering)
keywordsFinite element analysis AND Modeling
treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002
contenttypeFulltext


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