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    Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002::page 21004
    Author:
    Zhou, J. F.
    DOI: 10.1115/1.4027338
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from the periphery to the center of the substrate by a vacuum pump and heat transferred from the bottom surface of substrate can be removed by air flowing through channels. Corresponding to the given heat transfer power and the target temperature of substrate, the relationship among length, width and depth of channel was analytically established. By numerical simulation, local pressure drops at the joint of channels and air duct are first obtained and then the dimensions of each channel in a triangular array can be determined one by one. The investigation reveals that the widths of channels will vary with their depths, lengths and pressure differences between two ends. Since all channels are required for the same cooling power, the homogeneous heat transfer of heat sink can be realized. By assembling a certain number of heat sink units, the area of dissipation of heat sink can be enlarged and contoured to fit close to heating surface.
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      Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability

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    http://yetl.yabesh.ir/yetl1/handle/yetl/154462
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    contributor authorZhou, J. F.
    date accessioned2017-05-09T01:06:47Z
    date available2017-05-09T01:06:47Z
    date issued2014
    identifier issn1528-9044
    identifier otherep_136_02_021004.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154462
    description abstractA model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from the periphery to the center of the substrate by a vacuum pump and heat transferred from the bottom surface of substrate can be removed by air flowing through channels. Corresponding to the given heat transfer power and the target temperature of substrate, the relationship among length, width and depth of channel was analytically established. By numerical simulation, local pressure drops at the joint of channels and air duct are first obtained and then the dimensions of each channel in a triangular array can be determined one by one. The investigation reveals that the widths of channels will vary with their depths, lengths and pressure differences between two ends. Since all channels are required for the same cooling power, the homogeneous heat transfer of heat sink can be realized. By assembling a certain number of heat sink units, the area of dissipation of heat sink can be enlarged and contoured to fit close to heating surface.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDevelopment of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
    typeJournal Paper
    journal volume136
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4027338
    journal fristpage21004
    journal lastpage21004
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian