Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and DiscussionSource: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004::page 317DOI: 10.1115/1.2904384Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Modeling ,
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contributor author | F. Erdogan | |
contributor author | P. F. Joseph | |
date accessioned | 2017-05-08T23:32:20Z | |
date available | 2017-05-08T23:32:20Z | |
date copyright | December, 1990 | |
date issued | 1990 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26119#317_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106744 | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion | |
type | Journal Paper | |
journal volume | 112 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2904384 | |
journal fristpage | 317 | |
journal lastpage | 326 | |
identifier eissn | 1043-7398 | |
keywords | Modeling | |
tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004 | |
contenttype | Fulltext |