Abstract: An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts ...

Abstract: An approximated closed-form integrated circuit (IC) yield formula based on a Gaussian defect density distribution for the compounder in Murphy’s yield integral is presented. Also, a closed-form ...

Abstract: Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the ...

Abstract: The popcorning effect of plastic ball grid array (PBGA) packages is analyzed using the method of fracture mechanics. The following three specific problems are studied: (1) crack initiation in ...

Abstract: In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a ...