Chip on Board: Technologies for Multichip ModulesSource: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002::page 165DOI: 10.1115/1.2792085Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Multi-chip modules ,
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| contributor author | John H. Lau | |
| contributor author | Richard J. Prosman | |
| date accessioned | 2017-05-08T23:46:54Z | |
| date available | 2017-05-08T23:46:54Z | |
| date copyright | June, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26149#165_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115151 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Chip on Board: Technologies for Multichip Modules | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792085 | |
| journal fristpage | 165 | |
| identifier eissn | 1043-7398 | |
| keywords | Multi-chip modules | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 002 | |
| contenttype | Fulltext |